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Monday Newsletter
Sponsored
27th February 2023
Space 2.0: AMD Xilinx Technologies for New Space
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The New Space / Space 2.0 market continues to grow at a very fast pace with customers demanding FPGAs and SoCs with ever more functions, high speed interfaces, in orbit programming and excellent software tools and supporting IP.  We invite you to watch this on-demand webinar where we will introduce the latest AMD Xilinx products designed for the New Space / Space 2.0 market, for use in satellites, cubesats and nanosatellites. 
Sponsored
27th February 2023
LP-CC2652R7 CC2652R7 LaunchPad™ development kit for SimpleLink™ multi-standard wireless MCU
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This LaunchPad™ is used to speed development with the SimpleLink™ Multi-Standard CC2652R7 wireless MCU with support for Bluetooth®, Zigbee® and Thread.  Software support is provided by the SimpleLink CC13XX-CC26XX software development kit (SDK).
Eco Innovation
27th February 2023
Unique partnership makes scalable carbon capture technology a reality
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Effective carbon capture will no longer be reserved for large-scale operations in heavy industries, after Ingersoll Rand and Aqualung partnered together to design a modular, scalable, and instantly deployable capture solution.
Design
27th February 2023
Saelig introduces compact Amplicon Impact-D embedded PC range
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Saelig has introduced the Impact-D 1100A series, the rugged, powerful, yet small DIN rail mountable embedded computers designed by Amplicon. This important extension to their embedded computer range - Impact-D 100EL-A and Impact-D 1100A - offers new levels of CPU and graphics performance, with integrated IoT and AI features, real-time performance, manageability, security, and functional safety.
Wireless
27th February 2023
Renesas presents wireless power transmitter tech at ISSCC
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Renesas announced that the company presented advancements of charging technology for mobile devices at the International Solid-State Circuits Conference (ISSCC) in San Francisco. During the conference, Renesas described its single-chip wireless power transmitter solution that measures AC and DC transmitter power. 
Industries
27th February 2023
Infineon announces 'user-friendly' LCC design tool
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Lighting accounts for a significant portion of the world's total electricity consumption, emphasising the importance of energy-efficient solutions in this sector. 
Metaverse
27th February 2023
Anritsu to show Metaverse simulation environment with InterDigital
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Anritsu and InterDigital have developed a simulation environment that demonstrates how a user’s experience of an immersive Metaverse can be enhanced.
Appointments
27th February 2023
Brian Gumbel appointed president of Armis
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Armis have announced the promotion of Brian Gumbel to President of Armis with immediate effect. Gumbel will provide enhanced go-to-market strategic guidance across the entire business, as it continues to accelerate its growth and prepares for a future IPO. Brian will directly report to Yevgeny Dibrov, Chief Executive Officer and Co-founder of Armis and continue to be a member of Armis’ executive team.
News & Analysis
27th February 2023
Digi-Key launches supply chain transformed season 2 video series
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Digi-Key Electronics has released the first episode in Season 2 of its ‘Supply Chain Transformed’ video series focused on advancements in IoT, connectivity, sensors, and asset tracking within the supply chain.
Events News
27th February 2023
MediaTek to showcase its satellite connectivity technology at MWC 2023
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At MWC 2023, MediaTek will be demonstrating its 3GPP Non-Terrestrial Network (NTN) technology that brings two-way satellite communications to smartphones. The first smartphones with MediaTek’s satellite connectivity are also launching, with more devices to be unveiled in the coming months. Additionally, MediaTek will also be sharing a sneak peek of its next-generation 5G New Radio NTN (NR-NTN) technology for the next wave of satellite-enabled devices.
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