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| The increasing number of electronic functions in modern cars must be realized within a given space necessitating components to shrink in size. However, smaller packages need to dissipate the same amount of heat on a reduced footprint, leading to a higher power density on the board. DFN packages with their compact dimensions and thermal properties are the right choice. |
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| The TPS6291x devices are a family of high-efficiency, low noise and low ripple current mode synchronous buck converters. The devices are ideal for noise sensitive applications that would normally use an LDO for post regulation such as high-speed ADCs, clock and jitter cleaner, serializer, de-serializer, and radar applications. |
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| With network operators’ relentless pursuit of new revenue generating services to launch on their networks, mission-critical communications on top of the cellular network has now become a compelling option; “don’t miss the boat” recommends MCX solutions enabler Softil |
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| Computing revenue for ADAS and infotainment processors is growing even faster, driven not only by the growing penetration of these systems but also by the centralisation trend. |
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| Heraeus Electronics announced the launch of its new PowerCu Soft Laser Ribbons (LRB) for Laser Bonding during PCIM Europe in Nuremburg. |
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| Introducing a new book that intuitively covers many aspects of digital innovation in various industries, particularly the field of intelligent automation. |
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| Infineon Technologies Bipolar GmbH has expanded the Prime Switch family with the Press Pack IGBT with internal freewheeling diodes in Ceramic Disc Housings. |
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| Avnet Silica will exhibit at embedded world, the leading trade fair for the embedded community, from 21 – 23 June 2022 in Nuremberg, Germany. |
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| Septentrio takes a step towards simplifying the integration process of its inertial GNSS receivers. |
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| Global demand for eSIMs is skyrocketing — in 2021, there were 1.2 billion eSIM-enabled devices, and this figure is expected to rise to 3.4 billion by 2025. |
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