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| Join our panel of experts from TE Connectivity for a look behind the scenes into the technology enabling smarter buildings and the controls within them. You’ll learn how efficient management of energy consumption and security, optimisation and user convenience are just a few benefits component technology provides. |
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| CEA, in collaboration with CNRS Néel, a team in SI-based quantum computing, presented two papers on that topic at IEDM 2021, including an invited paper that identifies the material and integration challenges facing large-scale Si quantum computing. |
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| Does your industrial control system include customized logic? Do you have an FPGA, CPLD, or external logic components supplementing your embedded controller and wonder “why can’t this all be done in one device?” Are you using this additional logic because your MCU peripherals don’t give you all the capability you need? With the Configurable Logic Block (CLB) peripheral you are able to implement custom logic and even augment existing C2000 peripherals like the PWMs, captures, quadrature encoder, and GPIOs. This can enable you to integrate critical functions into a single C2000 MCU and reduce in size or completely eliminate your FPGA, CPLD, or external logic components.
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| Edge computing has realised the full potential of artificial intelligence (AI), machine learning and internet of things (IoT). These technologies are being infused into every corner of our lives—autonomous driving, smart buildings, robotics, supply chain management and healthcare. |
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| Kidney Research UK is working in partnership with IN-PART’s Discover platform to find and fund new innovative partners and solutions. |
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| CEA-Leti has reported the world’s-first demonstration of 16-kbit ferroelectric random-access memory (FeRAM) arrays at the 130nm node that advances this energy-saving technology closer to commercialisation. The breakthrough includes back-end-of-line (BEOL) integration of TiN/HfO2:Si/TiN ferroelectric capacitors as small as 0.16 µm², and solder reflow compatibility for the first time for this type of memory. |
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| Rohde & Schwarz and customised test system supplier NOFFZ Technologies have integrated the field-proven R&S Compact Antenna Test Range (CATR) reflector technology and advanced radar echo generator R&S AREG800A into NOFFZ’s End-of-Line (EoL) radar sensor test system, the UTP 5069 CATR. |
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| Rutronik is stocking the current generation of ATP DRAM modules, the DDR4. The data transfer rate of up to 3200 MT/s ensures an increase in the possible maximum clock speed. |
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| RS Components (RS) has expanded its Design and Manufacturing Solutions offering by partnering with Eurocircuits – a manufacturer and assembler of prototype and small series printed circuit boards (PCBs). |
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| A new approach to towers, growth of neutral hosts, and an expansion of private networks. Those are three strong trends to consider in telecom infrastructure for next year. This according to Fergal Lawlor, CEO at antenna solutions provider Alpha Wireless. |
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