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| Many companies turn to modular PXI-based systems for cost, size, repeatability, versatility and ease-of-use. In a production environment, the benefits of modular systems mentioned above are even more apparent. |
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| The TPSM5D1806 dual 6-A output power module is a highly integrated and flexible DC-DC power supply packaged in a compact 8-mm × 5.5-mm × 1.8-mm, QFN package. The input voltage range of 4.5 V to 15 V allows conversion from a wide intermediate bus as well as standard 5-V and 12-V rails. The two 6-A outputs can be configured independently for two separate power rails or combined for a single 2-phase, 12-A output. |
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| Advantech has introduced its new out-of-band edge management solution – an intelligent board management controller known as an iBMC. |
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| Mouser Electronics says it can now offer time-saving design solutions featuring the complementary and combined product portfolios from Renesas Electronics and Dialog Semiconductor, following Renesas’ acquisition of Dialog last month. |
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| Class-D audio high-power amplifiers have succeeded in professional and high-end consumer markets by offering a combination of small size, low heat dissipation, high integration, and good sound. Efficiency is considered a strong point of the class-D topology; which could be the key to eliminating the bulky heatsinks needed by traditional analog amplifiers, thus permitting smaller, more lightweight solutions. Their smaller size delivers practical benefits, expanding styling opportunities, permitting new generations of equipment better suited to home use and small studios, and allowing more channels to be integrated into a single unit.
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| Infineon and Panasonic have signed an agreement for the joint development and production of the second generation (Gen2) of their gallium nitride (GaN) technology, claiming to offer higher efficiency and power density levels. The performance and reliability combined with the capability of 8" GaN-on-Si wafer production mark Infineon’s strategic outreach to the growing demand for GaN power semiconductors. In accordance with market requirements, Gen2 will be developed as 650V GaN HEMT. The devices will allow for ease of use and provide an improved price-performance ratio, targeting, amongst others, high- and low-power SMPS applications, renewables, motor drive applications. |
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| GaN Systems have introduced two transistors into the portfolio of GaN power transistors. The transistors are packaged in a standard 8×8 mm PDFN package. |
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| The THR line comprises four series of DC/DC converters between 3W and 40W with reinforced isolation (3,000VAC). These regulated DC/DC converters come in either a DIP-24 or 2”x1” package and also feature increased resistance against shock and vibration according to EN 61373. The THR 3WI, THR 10WI and THR 20WI also have an internal input filter to comply with EN 55032 class A. Efficiencies up to 90% allow safe operation from –40°C to +80°C (with derating). |
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| Xilinx and Motovis have announced that the two companies are collaborating on a solution that pairs the Xilinx Automotive Zynq system-on-chip platform and Motovis’ convolutional neural network IP to the automotive market, specifically for forward camera systems’ vehicle perception and control. The solution builds upon Xilinx’s corporate initiative to provide customers with robust platforms to enhance and speed development.
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| STMicroelectronics’ STDRIVEG600 half-bridge gate driver has high current output and 45ns propagation delay, closely matched between high-side and low-side outputs, to handle high-frequency switching of GaN enhancement-mode FETs. |
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