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| What impact will graphene have on daily life? Vincenzo Palermo, vice director of the Graphene Flagship looks at some current sustainability projects.
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| The 7th generation of TRENCHSTOP IGBTs from Infineon is especially designed for variable speed drives. They are in stock at distributor Digi-Key. |
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| A new commercial IHLP low profile, high current inductor said to be the industry's first composite inductor in the 19 mm by 19 mm by 7 mm 7575 case size has been released by Vishay Intertechnology. |
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| Texas Instruments’ DRV8212 is an integrated motor driver with four N-channel power FETs, a charge pump regulator, and protection circuitry. |
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| Increased automation in industry to create smart factories will rely on technical innovation by power supply manufacturer, says Patrick Le Fèvre, chief marketing and communications officer, Powerbox |
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| GaN Systems and ON Semiconductor have released a new 300W BTP-PFC Bridgeless Totem Pole Power Factor Correction (PFC) evaluation board. The board includes ON Semiconductor's NCP1680, the industry's first dedicated critical conduction mode (CrM) bridgeless totem pole PFC controller, and GaN Systems' 650V GS66508B GaN transistors. |
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| The design-in of high voltage (HV) power modules presents a number of challenges, some of which are application-dependent, says Hafiz Khalid senior high voltage product manager, XP Power |
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| Changes in DC/DC converter technology have introduced new materials, digital control and smaller form factors, explains Lars Foerster, DC/DC business development manager, EMEA, TDK-Lambda |
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| Neousys Technology has released new supercapacitor UPS variants to its SEMIL extreme rugged computer family. With a built-in patented SuperCAP UPS, these new SEMIL family members can prevent data loss, offer greater reliability and longevity over traditional battery UPS. The SEMIL-1700 (IP67 rated) and SEMIL-1300 series are feature-rich standard 2U 19'' half-rack fanless computers powered by an Intel C246 workstation-grade platform to support a Xeon E or 9th/ 8th-Gen Core processor. In addition, they come with a patented passive thermal design that allows for -40 to 70°C fanless operations. |
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| GaN brings efficiency advantages compared with silicon, say Giuseppe Bernacchia, senior principal application engineer and Moshe Domb, director application engineering at Infineon Technologies |
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