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Thursday Newsletter
Sponsored
24th June 2021
Addressing the pain points in schematic and PCB design
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PCB design presents very specific issues for Design Automation tools, as the BOM may call for many different components and models. A new approach, using a browser embedded into the eCADSTAR Schematic and PCB design software, addresses these challenges. A new article by Zuken discusses the pain points that many designers endure - especially when creating prototypes - and the solutions.
Webinars
24th June 2021
Combine AI with the IoT to Get AIoT
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In PC years, the IoT is quite long in the tooth. AI and machine learning, on the other hand, are just pups. When you combine these two complementary technologies, you get AIoT, or Artificial Intelligence of Things. You had better be ready for it, because this is one of those seminal technologies that will dominate the landscape, sort of “get on board or get out of the way.”
Sponsored
24th June 2021
PLAY Socionext‘s #SoCcer SkillShot Euro Challenge to win a GoPro HERO9 Black
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#EURO2021 is here - so get in the mood and PLAY our #SoCcer SkillShot game. All scores over 500 will be entered into the prize draw to WIN a GoPro HERO9 Black with GoPro/Socionext developed GP1 chip inside. PLAY this challenging game – be a CHAMPION and WIN, we’ll be cheering you on! Have a great match – enjoy and good luck!
Webinars
24th June 2021
Texas Instruments Webinar: Evolution of EV Charging and solutions for future needs
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As the new electric vehicles have higher ranges and larger battery capacities than their predecessors, the demand for fast DC chargers to support quick charging requirements is increasing. Join our speaker, Harald Parzhuber, as he explains solutions and implementations ranging from simple AC-charge systems to ultra-fast DC-chargers, finishing with an outlook into the future trends.
Micros
24th June 2021
MCU development standard is ‘game changer’ for embedded systems design
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MikroElektronika (MIKROE), the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, has launched SiBRAIN, a standard for add-on development boards that facilitates the simple installation and exchanging of a microcontroller (MCU) on a development board equipped with the SiBRAIN socket.
Wireless
24th June 2021
VR and 5G: A world of endless possibilities
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Technology is constantly evolving and while some innovations have a niche impact, others have far greater potential to enhance the lives of many people. 5G is one of the enabling technologies that is driving innovation in a variety of sectors and is likely to benefit many millions of users. Lee Ettleman, Director Corporate Strategy, and Corporate Development at Molex explains further.
Security
24th June 2021
The role of electronics manufacturers in device security
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Cyber threats and attacks are a stark reality for everyone in today’s world, from organisations and manufacturers to individuals. The problem also reaches every industry, including healthcare, logistics, retail, and manufacturing. Electronics and technology writer, Devin Partida explains the role of device security.
Artificial Intelligence
24th June 2021
SAS AI-powered chatbot boosts fraud victim support
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Facing increased demand for real time and personalised digital experiences, organisations are turning to virtual assistants and chatbots to engage with consumers in new ways, at any hour. SAS, has partnered with the Identity Theft Resource Center (ITRC) to develop a customised virtual assistant to help fraud victims. The virtual assistant is built with SAS Viya.
Automotive
24th June 2021
Nissan accelerates assembly line with 3D printing solution
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Having successfully integrated 3D printing into its production process in its Barcelona factory, automotive giant, Nissan now has the proven capability to expand its use of the technology in the UK.
Industries
24th June 2021
Nexperia invests $700m to boost production capacity
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Nexperia has announced the latest stage of its global growth strategy, confirming a $700m investment over the next 12-15 months at its European wafer fabs, assembly factories in Asia and global R&D sites to increase production capacity.
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