|
|
|
|
|
|
|
| The intelligent BICKER UPSI-2412 ensures the uninterruptible 24V DC power supply at all times. The 10-year battery pack BICKER BP-LFP-2725 with lithium iron phosphate cells and integrated BMS is designed for industrial and medical applications that place the highest demands on quality, safety and reliability (IEC62133-2/UN 38.3 approved). For easy Plug&Play installation the UPSI-2412 with integrated USB interface is recognized directly by the IPC operating system as a UPS - without additional drivers or software installation. |
|
|
|
|
|
|
|
| On June 24th meet our technical experts in this webinar and discover how TI Motor Drivers reduce design time and complexity by integrating protection features and current sensing into your body electronics. We will discuss design challenges in current sense, diagnostics & protection (with power off braking) and how to overcome them with our broad and scalable portfolio. |
|
|
|
|
|
|
|
| Aldec has launched HES-DVM Proto Cloud Edition (CE). Available through Amazon Web Service (AWS), HES-DVM Proto CE can be used for FPGA-based prototyping of SoC / ASIC designs and has a focus on automated design partitioning to greatly reduce bring-up time when up to four FPGAs are needed to accommodate a design. |
|
|
|
|
|
|
|
| STMicroelectronics and Metalenz have announced a co-development and license agreement that will see ST develop manufacturing processes for Metalenz’s meta-optics technology for next-generation smartphones, consumer devices, healthcare, and automotive applications. |
|
|
|
|
|
|
|
| Rohde & Schwarz and Colby Instruments have joined forces to provide the UWB ecosystem with an extremely accurate test solution for angle of arrival (AoA) and phase difference of arrival (PDoA) characterisation. |
|
|
|
|
|
|
|
| An increasing number of consumers are being impacted by the global chip shortage that currently plagues the electronics manufacturing sector. The semiconductor supply chain is unique, but there are lessons that all manufacturers can learn from its shortcomings. Here Neil Ballinger, Head of EMEA at automation parts supplier EU Automation, has discussed how the global chip shortage can teach us a valuable lesson in resource management. |
|
|
|
|
|
|
|
| NXP Semiconductors announced that its Trimension Ultra-Wideband platform now offers fine ranging for new tagging use cases. UWB and Bluetooth Low Energy solutions have been combined to deliver spatial awareness to the new Samsung Galaxy SmartTag+, providing an enhanced experience to the Samsung SmartThings Find service. |
|
|
|
|
|
|
|
| knitter-switch has extended its product range of micro/snap-action switches available to the market. These products are used in diverse applications, such as: car comfort accessories, tooling and industrial machines, household appliances, adjustable furniture ie. desks or medical beds & bedside tables, stairlifts, and anti-tamper contacts. |
|
|
|
|
|
|
|
| NXP Semiconductors and TSMC has announced the release of NXP’s S32G2 vehicle network processors and the S32R294 radar processor into volume production on TSMC’s advanced 16 nanometer (nm) FinFET process technology. |
|
|
|
|
|
|
|
| Bringing a new chip to the automotive market can be daunting due to the high safety standards required - ISO 26262. Sondrel has made this much easier for customers with the launch of its new, quad-channel, IP reference platform that has been architected with ISO26262 applications and the fast integration of customer IP in mind from the start. |
|
|
|
|
|
|
|
|
|
|
