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Wednesday Newsletter
Sponsored
11th November 2020
Metal or plastic quick disconnects? What you should know
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Historically, liquid cooling has utilised metal quick disconnects, but today’s thermal engineers also have the option of choosing connectors of high-performance thermoplastics. In many cases, the performance of PPSU fittings rivals or surpasses that of metal. Read our whitepaper to understand key considerations you should make when determining which connector is right for your application.
Sponsored
11th November 2020
Spot Cooling for Industrial Lasers & Optics
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A focused laser beam can generate a significant amount of heat. High-power industrial lasers can generate in excess of 10,000 Watts during operation of thick metals. Temperature control of the sensitive optics inside the laser needs to be maintained to achieve peak performance. This application note will focus on how thermoelectric coolers can be used for spot cooling of industrial laser optics.
Sponsored
11th November 2020
Power Conversion in Mild Hybrid Electrical Vehicles
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In this whitepaper, ON Semiconductor highlights the methods for overcoming these MHEV design challenges, including sub-system design details for maximising cost and efficiency. The realisation of power converters using Automotive Power Modules and GaN devices are also explored.
Artificial Intelligence
11th November 2020
How artificial intelligence is changing cyber security
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Having contact with someone who has a cold increases the chances that you might pick up the bug yourself. In much the same way, businesses adding more connectivity into their system increases the opportunities for cyber criminals to introduce viruses into the system. Here, Sophie Hand, UK Country Manager at EU Automation, explains the role Artificial Intelligence (AI) can play in combatting cyber crime.
Analysis
11th November 2020
Global smartphone market shows resiliency
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The global smartphone market was able to recover from a tremendously difficult first half of 2020. The 0.9% year-on-year decline in Q3 is a significant improvement over the over 1%5, and worse, declines in each of the first two quarters of the year, according to Omdia’s latest global smartphone shipment preliminary result.
Automotive
11th November 2020
Ricardo shares perspectives on the future of truck tech
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Ricardo is once again sponsoring the ATZ Live heavy-duty, on- and off highway engines event on 10th-11th November - to be held online this year due to the COVID-19 pandemic - and will present papers on a range of technology themes of affecting the next generation of more efficient and less polluting heavy-duty vehicles.
Micros
11th November 2020
MCU-based face recognition with liveness detection
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NXP Semiconductors has announced its latest NXP EdgeReady IoT solution for secure face recognition that enables original equipment manufacturers (OEMs) to quickly, easily and inexpensively add vision-based touchless access control.
Lighting
11th November 2020
Micro-LED: lighting the way for display technologies?
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Micro-LED technology has been exciting the trade and consumer tech press for several years now, particularly since 2014 when Apple purchased the micro-LED-focused startup, LuxeVue. The implication that leading tech firms were racing to incorporate micro-LED in their highly desirable consumer tech prompted a flurry of speculation that micro-LED would be the ‘next big thing’ in TVs, smartphones, wearables and much more.
Cables/Connecting
11th November 2020
Push-pull system increases installer productivity
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TE Connectivity (TE) has announced that it is extending its M12 portfolio of connectors and cable assemblies with the introduction of its push-pull system technology. The new push-pull variant saves time, is backwards compatible and doesn’t require additional tools to be installed — streamlining the entire M12 installation process.
Optoelectronics
11th November 2020
Surface mount UV LEDs for curing and horticulture
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The Broadcom 3W 3535 Surface Mount UV LEDs are energy-efficient LEDs that can be driven at high driving current and are able to dissipate heat efficiently, resulting in higher reliability. Their low-profile package design addresses a wide variety of applications where superior robustness and high efficiency are required.
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