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engcon to exhibit at CONEXPO-CON/AGG 2023 in Las Vegas
On 14–18th March, 2023, it's time for one of the year's largest machine trade shows, CONEXPO-CON/AGG 2023, in Las Vegas, USA.
Weebit Nano ReRAM IP now available in SkyWater Technology’s S130 process
Weebit Nano, a developer of advanced memory technologies for the global semiconductor industry, and SkyWater Technology, the trusted technology realisation partner, announce availability of Weebit’s resistive RAM (ReRAM) IP in SkyWater’s 130nm CMOS (S130) process.
Hamamatsu’s new factory to meet the demand of the opto-semiconductor device market
Hamamatsu Photonics will construct a new factory at its Shingai Factory site located in Shingai-cho, Minami-ku, Hamamatsu City, Japan to increase overall production capacity in the post-processing (dicing, assembly, and inspection) of opto-semiconductor devices.
Listen introduces a new portable dual-channel audio interface
AudioConnect 2, Listen’s new compact and high resolution two-channel audio interface is designed for measurements anywhere from the production line to out in the field and is particularly suitable for headphone testing and in-car measurements.
Intel Arc A750 graphics cards for gaming available at Rutronik
Rutronik carries the Intel Arc A750, one of Intel's first-generation Arc graphics cards.
Razorcat introduces new features: Hyper Coverage and Code Access in TESSY v5.1
At embedded world 2023, Razorcat is presenting a new version of their certified C/C++ unit and integration test tool TESSY including two innovative features: With “Code Access” and “Hyper Coverage” in TESSY v5.1, testers of embedded software can easily accumulate the coverage across different tests, testing levels and test tools – and automatically detect hidden or untested code in the full source code including all ...
SEMI Industry Advisory Council to advance global electronics supply chain
SEMI has announced that members of its Supply Chain Management (SCM) Initiative have formed an Industry Advisory Council (IAC), a group of industry leaders that will guide the initiative in its mission to advance an agile and resilient global electronics supply chain.
European Commission highlights WAAM3D as a key innovator
Wire Arc Additive Manufacturing (WAAM) company, WAAM3D, has been highlighted as a Key Innovator by the European Commission’s Innovation Radar. This is as a result of WAAM3D’s work with Cranfield University in creating multi-material add-on software for WAAM systems.
Pricer & Epishine to set foundation for sustainable electronic shelf labels
Today’s fast-paced retail environment requires innovative digital solutions without compromising sustainability.
IAR Embedded Workbench supports the STM32 MCU series
STMicroelectronics’ STM32C0 series promises to make 32-bit capabilities accessible to all developers at a low price.