News & Analysis

Global Micron deal gives Farnell more memory

18th March 2021
Mick Elliott

Farnell has strengthened its memory and storage solutions portfolio by signing an international distribution agreement with Micron Technology.

Adding Micron to Farnell’s line card of semiconductors gives its customers access to memory devices that support disruptive technologies such as artificial intelligence and 5G.

Micron devices are suitable for various markets, such as consumer, mobile communications, automotive, industrial design and data centres, as well as personal computing, networking and server applications.

Farnell’s in-stock range of Micron’s innovative product solutions include:

  • SLC NAND devices,such as theMT29F4G08ABAFAWP-IT:F, which offers the lowest cost-per-megabit of embedded code storage flash, reducing the overall bill-of-materials for applications such as interactive toys, books, games, web-enabled printers, computer peripherals and backward-compatible WiMAX boxes. Micron’s SLC NAND devices provide up to 100,000 P/E cycles for endurance and faster throughput than competing MLC and TLC NAND technologies. The devices are available in various package types and their densities range from 1Gb to 256Gb.
  • Automotive-grade LPDDR4, which offersultra-high speed, reliability and temperature support demanded by next-generation industrial, automotive and consumer applications. The MT53D512M32D2DS-053 AIT:D is a16Gb mobile, low-power DDR4 SDRAM device with a high-speed CMOS that can be internally configured, making it ideal for extreme conditions.
  • Serial NOR flash memory, such as theMT25QU128ABA1EW9-0SIT, provides a combination of features, including high-density fast data throughputs, secure data storage, architectural flexibility and long-term product support. The solution balances design requirements and cost.
  • 2100AI PCIe NVMe NAND Flash SSD products which provides increased performance and reliability in extreme conditions, making it an ideal solution for industrial applications that require mass storage in a tiny footprint. The 2100AI SSDs, including the MTFDHBK128TDP-1AT12AIYY, use a single-chip controller with a PCIe Gen3 interface connecting up to four PCIe lanes to Micron’s 3D TLC NAND Flash. The SSD is designed to efficiently use the PCIe interface during READs and WRITEs while delivering bandwidth-focused, low latency performance. SSD technology enables enhanced boot and application load times and reduced power consumption.

Lee Turner, Global Head of Semiconductors and Single Board Computing at Farnell said: “Micron is one of the world’s most well-known semiconductor brands and is a true innovator in the design, development and production of memory and storage solutions. Within the last 12 months, we have been heavily investing in our semiconductor range of offerings to ensure we can meet our customers’ diverse needs. Micron is a fantastic addition to our line card. Now, it will be easier than ever for our customers to get high-performance memory components for their solutions.”

Micron is the fourth largest semiconductor manufacturer in the world, with a broad portfolio of high-performance memory and storage technologies, including DRAM, NAND, and NOR.

Micron products are available now from Farnell in EMEA, Newark in North America and element14 in APAC.

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