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Smart wearable forum side event to NEPCON China 2015

7th April 2015
Jordan Mulcare

Due to the rising industry focus on wearable devices, Reed Exhibitions will work with Shenzhen Emtrain and 51wearable.com to launch a smart wearable forum as a side event to NEPCON China 2015. The forum will explore wearable market momentum, including key component assembly, system design strategies, electronic assembly solutions and finished product assembly. Case studies will facilitate deeper understanding of overall smart wearable assembly solutions.

The forum is expected to bring together engineers, assembly technicians, R&D managers, product managers and senior management from smartphone, smart TV, smart wearable, telecommunication and other consumer electronics sectors. Other participants will be from the fields of turnkey chips, processors, MEMS, voice commands, power management, internet and cloud players, wireless technology, modular providers, display and consumer terminals.

Wearable devices come in a wide range of forms, including devices for the medical and gaming fields, as well as those for everyday use. The development of wearable technology is transforming daily living. Some wearable devices have roughly the same capability as a typical desktop computer. Sophisticated wearable devices can be used for surveillance, monitoring and analysis of data captured by sensors.

Wearable devices are becoming hugely popular. With wearable technology, people enjoy a more intelligent lifestyle, personally and professionally. Wearable technology has benefits for mobile health care and fitness, among other areas. Alongside the wearable technical momentum, the fields of MCU, MEMS, wireless communication chips, power management, display modules, wireless power, micro-projector design, FPC assembly and other applications are new battlefields where challenges have to be addressed.

 

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