RF to Light solutions for wireless network infrastructure at MWC 2016
M/A-COM Technology Solutions will debut a recently expanded portfolio of wireless infrastructure solutions, the largest of its kind in the industry, at Mobile World Congress (MWC) 2016. Optimised to meet the most demanding bandwidth, performance and efficiency needs, MACOM’s semiconductor solutions for wireless infrastructure set new standards for integration, ease of use and cost effectiveness.
“The breadth of MACOM’s leading-edge technology expertise and wireless application experience is unrivaled in the semiconductor industry, enabling mobile network operators around the globe to keep pace with burgeoning bandwidth demands while minimising capital and operating expenses,” said Preet Virk, Senior Vice President and General Manager, Carrier Networks, MACOM. “Addressing the needs of 4G, 4.5G and 5G wireless infrastructure, with the proven ability to support high frequency backhaul and access technologies; MACOM provides a one stop shop for high-performance RF, microwave, millimeterwave and optical components.”
Among the solutions and technologies that MACOM offers for wireless network infrastructure:
MACOM GaN – Slated to debut at MWC 2016, MACOM’s MAGb series of GaN power transistors for macro basestations produce GaN performance at LDMOS like cost structures at scaled volume production levels. MAGb power transistors target all major cellular bands within the 1.8 to 3.8GHz frequency range, and support peak output power up to 700W.
Small Signal Solutions – MACOM’s solutions for basestation receivers span from discrete high power switch, Low Noise Amplifier (LNA), digital step attenuators, variable voltage attenuators and control components to semi and fully-integrated front end modules that combine these devices with optional bias and matching capabilities. These highly integrated modules are ultra-compact and easy to use, and provide a wide range of customisation and scalability options.
Microwave Power Amplifier (PA) Portfolio – The latest entries in MACOM’s family of GaAs PAs for wireless backhaul applications enable full frequency band coverage from 7 to 86GHz, with narrow and wideband PA options to ensure breakthrough deployment flexibility.
E-Band Power Amplifiers and Integrated Modules – MACOM’s industry leadership in millimeterwave (mmWave) wireless backhaul technologies is exemplified by its family of E-Band PAs and modules. Helping to accelerate the evolution to higher capacity backhaul, MACOM’s surface mountable E-Band Tx and Rx modules simplify the design and manufacturing of low cost E-Band point-to-point radios.
Next-generation 5G and MIMO Technologies – MACOM is uniquely suited to aid the development of 5G and MIMO demonstration systems, with decades of experience in mmWave and proven expertise from the circuit level to the device packaging level, and established leadership in phased array technologies. Providing the ability to integrate multiple components into ultra-compact front end modules, MACOM can help facilitate the design of large antennae arrays supporting advanced 5G beamforming capabilities.
Optical Transport Components – MACOM offers a comprehensive portfolio of optical fronthaul (CPRI) and optical backhaul (GPON) lasers and chipsets to complement its RF and microwave product portfolio for wireless infrastructure.