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Harwin showcase Mil-Aero connectors at Paris Air Show

10th June 2015
Nat Bowers
0

Exhibiting on Stand FG176 in Hall 2B at the Paris Air Show, Le Bourget, 15th to 21st June, Harwin will demonstrate its Mil-Aero connectors and Datamate, Gecko and M300 high-reliability connector systems which withstand the severe shock, vibration and temperature conditions experienced in satellites, commercial and military aircraft, UAVs and spacecraft.

Harwin’s M300 durable power connector family of high-density interconnects is based on a 3mm pitch and handles currents up to 10A. Designed for rugged environments, these durable interconnects offer superior electrical and mechanical performance. Able to withstand temperatures from -65 to +175°C, they are rated for 1,000 mating cycles, more than twice the number of older generation products. The M300 series features keyway polarisation and identification of the best position for ease of mating. Jackscrews are available for extra security.

For high-reliability applications where space and weight are critical, Gecko’s dense pin spacing of 1.25mm and up to 50 contacts per connector achieves a 35% space saving over other high-performance connectors such as Micro-D. These low profile, dual row cable-to-board and board-to-board interconnects provide a high reliability, high performance, micro-miniature interconnect solution and offer exceptional performance for their size, with a current rating of 2A per contact simultaneously and contact resistance of 20mΩ.

Harwin’s Datamate family offers a broad range of board-to-board, board-to-cable and cable-to-cable options and includes the Datamate high-reliability/high performance 2mm pitch connector system. Proven in applications under the most extreme conditions, Datamate hi-rel features Harwin’s unique four-finger beryllium copper contacts to ensure continuity of connection, even under conditions of 100G shock, 40G bump and 10G vibrations. Maximum current is 3A.

The Harwin team will be on hand throughout the show to discuss customer requirements.

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