Events News

KIC has announced that it will exhibit in Hall 7a, Booth 321, at SMT Hybrid Packaging, scheduled to take place 5th to 7th May 2015 in Nuremberg, Germany. The KIC RPI brings process and deficiency information to the thermal process that was previously limited to screen printing and pick-and-place machines.

This year, representing Israel, Seica will be present in the Spider Engineering Booth at NewTech Exhibition, where it will be showing the Pilot4D V8 flying probe and the ATE/instrument MINI 80/200 system. The company has also announced the twentieth anniversary of its first flying probe tester sale.

The UK is fast becoming the entrepreneurial hub of Europe, and Cambridge is one of the cities flying the flag. Research released last month from Barclays and Business Growth Fund showed a staggering 8.6% of 18 to 64 year-olds are involved in start-ups. Thanks to growth in crowdfunding, incubators and accelerators, it is easier than ever for start-ups to get off the ground.

M/A-COM Technology Solutions (MACOM) will showcase its GaN RF product portfolio at IMS2015 in Phoenix, from the 19th to 21st May. MACOM’s booth will feature the latest, revolutionary Gen 4 GaN-on-Silicon product solutions optimised for commercial, ISM applications.

A low-power USM-MEMS-VOC sensor module from Unitronic that enables an especially rapid detection of different Volatile Organic Compounds (VOCs) in the air will make its debut at SENSOR+TEST 2015 in Nuremberg (19th to 21st May). The Unitronic Sensor Module (USM) measures just 15x17x3mm.

Aegis Software will demonstrate its FactoryLogix manufacturing operations solution at booth 7A-219 during the SMT show from 5th to 7th May. Visitors to the booth will see how FactoryLogix enables manufacturers to accelerate the delivery of complex, configured-to-order electronic assemblies and box-builds, while ensuring high quality standards and providing total product and process traceability.

Lighting system design based on LED and OLED technologies is challenging. Successful LED lighting solutions require a holistic design and engineering approach. Hence, it is necessary to incorporate latest technologies, smart systems, new standards, advanced functionalities and user behaviours.

  Engineered Materials Systems will exhibit in Booth #202 at ECTC 2015, scheduled to take place 26th to 29th May, 2015 in San Diego. Company representatives will showcase its DF-3000 series Negative Film Photoresists. The DF-3000 series is available in various thickness formats from 5-50µm, ±5%.

Blakell Europlacer announces an expanded presence in Hall 7, Booth 7-318 at SMT Hybrid Packaging 2015. Europlacer will showcase an extended range of equipment, including the iineo-I pick-and-place machine, together with the latest software options and its ifeed-cart.

  Saki will demonstrate its BF-3Di automated optical inspection and BF-3Si automated solder paste inspection systems at this years SMT Hybrid Packaging, at Stand 7-331. Saki's BF-3Di and BF-3Si are true 3D algorithm-based inspection systems with 1μm resolution.