Events News

At CeBIT 2014, March 10-14 in Hannover, Germany, Lian Li will exhibit the DK01 desk chassis, three community collaborated chassis and two unreleased models that, according to the company, 'attendees will not want to miss'. Lian Li invites all interested parties to visit them at Hall 17, Booth F24.

At APEC 2014, The Power Sources Manufacturers Association (PSMA) Packaging Committee is sponsoring an industry session, titled: “3D Packaging for Power Electronics”. The session will present proven and available techniques to implement 3D packaging in power supplies today, while speakers from leading research facilities will provide a look into the future.

At this year's IPC APEC EXPO, in Booth #1240, Production Solutions will present the RED-E-SET UPH Universal Part Holder and GoPad PCB Rework / Repair Board Holder.  

At Mobile World Congress (MWC), February 24-27 in Barcelona, Spain, Integrated Device Technology will be exhibiting innovative products from its industry-leading in hall 6, stand 6M27. IDT will demonstrate its portfolio of mixed-signal solutions suitable for a wide range of applications, focusing on solutions for wireless power and wireless infrastructure.

At this year's embedded World, in Hall 2 Booth 2-348, ADATA will be showcasing their latest products.

At embedded World 2014, on stand 350 in Hall 1, Renesas will launch Europe’s first MCU Car Rally competition for students.

At embedded world 2014, February 25-27 in Nuremberg, Germany, ERNI Electronics will present their expanded COM portfolio from Hall 4, Booth 348. The current models in the WHITEspeed COM family are complemented with new variants for higher performance and also for highly cost-sensitive applications.

At this year's APEC, scheduled in Fort Worth, Texas, Powervation will discuss its Intelligent Digital Power solutions for a number of applications. These applications include cloud/datacenter server infrastructure, high performance computing, power modules, and communications infrastructure.

Embedded software innovations continue to expand fast, creating new markets and revenues opportunities. The growing software complexity drives investments in improving development processes for faster time-to-market and higher quality targets. Responding to these needs, MicroEJ, designed by IS2T, offers a step forward with more flexible and efficient software development processes.

At embedded world 2014, February 25-27, in Nuremberg, Germany, Microsemi will be exhibiting from Hall 1 Booth 121. Company representatives will be on hand to address how Microsemi’s innovative products balance processing horsepower and connectivity of embedded systems with high-performance, low power, reliability and security.