Events News
5G capabilities to the fore in Barcelona
At Mobile World Congress (MWC) 2016 in Barcelona (Feb 22-25), Anritsu will be showing its extensive capabilities in supporting the industry development of 5G networks, with a range of technologies and research activities across the whole spectrum of network architecture, air interface, network access and service assurance.
Ciiva unveils intelligent parts data analysis
Ciiva will unveil intelligent parts data analysis & verification technology for PCB design at DesignCon 2016, a premier conference and technology exhibition for electronic design engineers. This technology powers new tools for engineers to seamlessly transform design intent into realisable design with the latest advances in data automation and analysis.
Development boards to feature at Embedded World
A comprehensive portfolio of solutions for embedded developers, from entry-level makers to established professionals will be featured by Arrow Electronics at Embedded World in Nuremberg (Feb 23-25). Key highlights at the booth, 258 in hall 5, will be the broad selection of development boards Arrow has created with selected technical partners, based on popular processors and system-on-chip ICs.
Silicon Labs to showcase IoT connectivity innovations
Silicon Labs will showcase the next wave of processing, sensing and connectivity innovations for the IoT at Embedded World 2016 in Nuremburg, Germany, 23rd-25th February, Booth 4A-128. Addressing an array of smart, connected device applications, Silicon Labs will demonstrate multi-node Thread and ZigBee mesh networks, Bluetooth Smart sensors and cloud connectivity, WiFi modules, multiprotocol wireless SoCs, high-accuracy optical and environm...
TE Connectivity exhibit at DesignCon 2016
At the DesignCon 2016 Expo in California, 20th to 21st January, TE Connectivity will showcase a range of industry-leading data communications connectivity solutions in booth 811. TE will offer both working demonstrations and displays of the latest products delivering the speed, scalability, space-savings, reduced thermals, power and reach that design engineers need for their next project.
HUBER+SUHNER unveil high speed radio frequency test components
At DesignCon 2016 in Santa Clara, HUBER + SUHNER, will unveil innovative new additions to their radio frequency test assemblies and multicoax connector catalogues. The Vector Network Analyser (VNA) test lead series Sucotest 500V join the existing portfolio of assemblies including SUCOFLEX 100, Sucotest 18/18A and Sucotest 26/40, globally recognised as offering superior test measurement capabilities and elite quality of radio frequency Transm...
Functional circuit test features at Nuremberg show
Functional circuit tests in real-time, high-performance bus simulation in vehicle networks and unrivaled test coverage from a single source are the highlights of GOEPEL electronic’s display at embedded world 2016 in Nuremberg (Feb 23-25). JEDOS, a recently introduced test platform is an embedded test & diagnostics operating system.
LpS 2016 announces call for papers
The LED professional Symposium +Expo (LpS), scheduled for 20th to 22nd September in Bregenz, Austria, addresses solid-state lighting technologies and its applications. Experts from the fields of industry and academia are invited to submit an abstract to present their latest developments and expectations for future lighting trends and innovations to a highly qualified audience. The deadline for submissions is 19th February, 2016.
Southern European Print Congress moves to Italy for 2016
FESPA’s 2016 Southern European Print Congress, delivered by four of its member associations, will take place from 19th to 20th April 2016, in Milan, Italy, following the success of the 2015 event held in Barcelona, Spain. The 2016 congress will be organised by Apigraf (Portugal), FESPA España Asociación, FESPA France Association, and the host country, FESPA Italia Associazione, in collaboration with FESPA as a corporate organi...
Smart Systems Integration 2016 – Conference registration now open
Smart Systems Integration 2016 will take place at the Holiday Inn Munich – City Centre in Munich, Germany from 9th – 10th March 2016. SSI focuses on complex systems up to their components. The presented contents are user- and industry-oriented and show the research and development potential worldwide.