Events News
LASER World of PHOTONICS returns to China
The PHOTONICS CONGRESS CHINA will be held again in conjunction with LASER World of PHOTONICS CHINA at the Shanghai New International Expo Center from 15–17th March, 2016. The Congress topics will range from the latest research and development in laser technology, laser processing and its applications, laser additive manufacturing and laser 3D printing, manufacturing of optical components, machine vision, optoelectronics, advanced laser mate...
What’s new at IDTechEx 2016?
Green technologies will take centre stage at this year’s IDTechEx Show, taking place in Berlin from 27th-28th April. Among these will be electric vehicles, which will have a major emphasis at the session ‘Electric Vehicles: Everything is Changing’. Speakers and exhibitors from companies including Toyota, Daimler, Tesla, Siemens and IBM will showcase how mechanical, electric and electronic parts are completely changing and often ...
Multiple 5G test solutions set for MWC in Barcelona
The latest communications design and test solutions, along with leading edge 5G wireless simulation and test solutions will be shown by Keysight Technologies at Mobile World Congress in Barcelona (Feb22-25). The Keysight demonstrations will focus on high-performance design and test solution requirements of the multiple usage scenarios of 5G mobile communications.
Dev kits to the fore at Embedded World 2016
Embedded World 2016 will see a significant Farnell element14 presence, as it showcases its latest dev kits, single-board-computers, software products, and services on-stand. It will also expand its presence across a second stand, the result of an exclusive partnership with NXP, where it will be demonstrating a dedicated selection of Internet of Things (IoT) enabling products.
Design for Testability showcased at Embedded World
Boundary Scan Market Supplier, JTAG Technologies will discuss Design for Testability (DfT) and Optimising ATE at the Embedded World show in Nuremberg (Feb23-25). The DfT challenge is the ‘Cinderella’ of the design process. Overcoming this challenge is not as exciting as designing and proving a new solution.
Hardware developer conference names lead sponsor
H/WExpo, a new UK conference for hardware development engineers has named JTAG Technologies the lead sponsor. The conference will cover such topics as board development, board bring up, hardware validation and production testing. H/WExpo will take place at Cambourne near Cambridge (April 27-28).
A wave of products on show at APEC 2016
Vishay Intertechnology will be highlighting its latest power MOSFET, IC, passive component and diode technologies for a wide range of applications at APEC 2016 – the Applied Power Electronics Conference taking place in California in March.
Leti to present at 5G Symposium
CEA-Leti will make two presentations during the EU-Japan Symposium on 5G, ‘From Challenges to Standardisation’, in Tokyo, 8-10th of February.The purpose of the gathering of European and Japanese stakeholders such as the European Commission, industry manufacturers, telecommunication operators, service providers, regulators, research organisations and government ministries is to discuss Japanese and EU perspectives for development of 5G...
IoTize nominated for 2016 embedded award
KEOLABS announced that its IoTize embedded connectivity technology is nominated for a 2016 embedded AWARD in the Hardware category. IoTize is a turn-key connectivity solution that allows companies to add RF interfaces such as NFC and Bluetooth to their products without redesigning the product’s firmware.
Translucent antennas to be showcased
Pulse Electronics Corporation's line of translucent antennas will be showcased at Booth 2440 at the DistribuTECH Conference and Exposition, being held at the Orange County Convention Center, Orlando, FL, February 9-11th, 2016. Pulse's Distributed Antenna System (DAS) ultra-thin, clear, ceiling mount antennas have been selected to enable wireless network coverage in building 7 of the World Trade Center, New York, NY.