Events News
Test solutions take the road to Shanghai
Test solutions for measuring the connected world – and everything in it – will be demonstrated by Advantest at the SEMICON China trade show in Shanghai (March 15-17). In addition to exhibiting, Advantest is sponsoring two events at the show - the Build China IC Manufacturing Ecosystem Forum and the China Semiconductor Technology International Conference (CSTIC).
Relieving the pressure of fleet management
Tyre pressure monitoring specialist, TyrePal, will exhibit at this year's Commercial Vehicle Show, taking place between the 26th and April 28th, at the National Exhibition Centre (NEC) in Birmingham. On stand 4K50, TyrePal will display two of its latest fleet monitoring products, the in-cab tyre pressure monitoring system (TPMS) and the TeleTPMS.
Z-LASER to present multicolour laser projector
Z-LASER Optoelektronik from Freiburg (Germany) is presenting - for the first time ever - its laser projector ZLP at this year’s JEC Composites Show in Paris. Z-LASER laser projectors are usually used in the composite industry, in branches like ship building, vehicle construction, scale modeling or space and aeronautics.
MicroEJ to contribute initial code to open source project
At EclipseCon in Reston, Virginia, MicroEJ presented the Eclipse Edje open source project. Edje defined a set of software APIs required to deliver IoT services that meet the performance and memory constraints of MCU-based devices. Edje also provided ready-to-use software packages for targeted hardware that developers can get from third parties for quick and easy development of IoT device software and applications.
HEITEC at Embedded World 2016
At Embedded World in Nuremberg last month, HEITEC emphasised its expertise in enclosure technology and in customised system integration with two demos ‘Out of the Box'. Various possibilities for the realisation of housing products up to complex system solutions in electronics and software are clearly presented with the 'HEITEC 4.0 TO GO' demo case.
Success for LEGIC at embedded world 2016
For the first time, LEGIC presented its secure and innovative IoT solutions at embedded world, in Nuremberg last month. LEGIC thank all ID Network Partners, new Business Partner IBM as well as the numerous new customers, interested parties and members of the press, who contributed to this successful event.
Manufacturing solutions at SMT/Hybrid/Packaging
Rehm Thermal Systems looks forward to meeting you at this year’s SMT/Hybrid/Packaging in Nuremberg from April 26th to 28th, Europe's leading trade fair for system integration in microelectronics. The electronics industry continuously meets new challenges in the processing of sensitive electronic components – from processing the smallest components, the highest standards in void-free solder joints and increased quality through resistan...
Smart Systems Integration 2016 conference programme
The anniversary event of Smart Systems Integration offers in its conference a wide range of topics and casts an intensive glance at current trends and future developments in the industry. Latest digital solutions regarding the interconnection of sensors, equipment or products and their data analysis play an important role.
PCIM Asia 2016 Conference programme now available
The programme for China’s leading international conference for power electronics held as part of PCIM Asia 2016 has been finalised. Well-known experts from science and industry will present their solutions, practical experience and the latest R&D results together with their applications in Shanghai.
Comprehensive lighting solutions at Light & Building
From Hall 4, Booth G61 at the upcoming Light & Building event taking place March 13th through 18th in Frankfurt, Henkel Adhesive Technologies will showcase its total solutions approach to modern lighting applications. With an innovative materials portfolio that addresses the full spectrum of lighting manufacturing requirements – from semiconductor packaging to solder to thermal management and encapsulation – Henkel delivers a sing...