BTU will showcase New PYRAMAX Capabilities at NEPCON South China 2012
BTU have today announced that it will highlight new High Efficiency flux management and dual-lane, dual-speed capabilities of its PYRAMAX solder reflow system, as well as the latest WINCON 5.0 control software in booth #1J10 at the NEPCON South China 2012. The electronics manufacturing showcase event is scheduled to take place August 28-30, 2012, at the Shenzhen Convention & Exhibition Center, China.
Aqueous will Demonstrate its Flagship Trident System at IPC Midwest
Aqueous has today announced that it will be highlighting its flagship Trident system – the Trident LD – in Booth #103 at the upcoming IPC Midwest Exhibition & Conference, scheduled to take place August 22-23, 2012 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL.
Plextek calls for a UK Cyber Attack Prevention Agency at Security & Defence SIG meeting
Plextek is championing the latest Security and Defence SIG meeting, looking at wireless communications in an increased threat environment. The meeting will look at Critical National Infrastructure defence and Plextek’s view is that the UK needs a Cyber Attack Prevention Agency to effectively prevent against cyber attacks. The SIG meeting takes place in London on the 19th of April and is run by Cambridge Wireless.
Only solder solders, the rest suffer
Soldering, 3-D placement and the future of high-precision screen printing: These were the topics addressed during Essemtec’s Technology Day, which took place in Aesch, Switzerland, on September 8, 2011. More than 100 people visited the free event, making it a success for all.
Teknek To Present At Aimcal Web Coating Conference
Teknek presentation will focus on the appropriate application of contact cleaning within the production of coated products. In particular the talk will look at the impact of contamination in emerging technologies such as OPV (Organic Photovoltaic) and plastic electronics where the requirement for high barrier coatings means that even miniscule defects are detrimental to product lifespan.
ESSEMTEC to Highlight Flexible Swiss Made Solutions at IPC/APEX 2011
Essemtec announces that it will feature a range of new equipment in Booth #773 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Six new products to be launched by Teknek at IPC/APEX
Teknek, a leader in contact cleaning technology, is to launch six new products at the IPC/Apex show in Las Vegas. Teknek’s Surface Mount Clean Machine (SMT09), designed for the electronics assembly market, has not only undergone a redesign but it now incorporates full static monitoring to ensure that static levels on outgoing boards are below levels pre-set by the customer. This machine is combined with Nanocleen, the world’s first si...