Nihon Superior Debuts Selector Guide for SN100C Solder Pastes

It includes SN100C P500 D4 for excellent reflow with minimum incidences of solder balling and mid-chip balling, SN100C P520 D5 for excellent reflow on very small pads and chip components down to 01005 (0402 metric), and SN100C P800 D2 low voiding paste for high-reliability assembly. Additionally, the completely halogen-free SN100C P602 D4 features minimal incidences of corrosion-induced whiskers.

With a linear ramp to peak temperature of 240°C, SN100C lead-free solder pastes can be reflowed with a similar linear reflow profile to that commonly used with Sn-3.0Ag-0.5Cu even though the melting point of the SN100C alloy is approximately 8°C higher.

Completely halogen-free means that it does not contain F, Cl, Br or I.