Rohde & Schwarz, Fujitsu extend chip development

18th February 2015

Mick Elliott

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Fujitsu Semiconductor Europe (FSEU) and Rohde & Schwarz (R&S) have extended their long-standing cooperation to focus on developing a customised System on Chip (SoC) using a production technology of 28nm. This SoC will be used in Rohde & Schwarz test and measurement instruments.

Roland Steffen, Executive Vice President and Head of Test and Measurement Division at Rohde & Schwarz, comments: “Our instruments and test systems set new standards in research, development, production and service worldwide. To keep and develop this position we need a strong and reliable technology partner. In FSEU we found such a partner who has proven its expertise and capabilities in developing state-of-the-art ASICs tailored to our needs and those of our customers.”

Brendan Mc Kearney, President at Fujitsu Semiconductor Europe responded: “FSEU is proud to be part of this sophisticated high end technology co development project. Our team of dedicated design and implementation engineers will work closely together with Rohde & Schwarz to leverage FSEU’s ASIC expertise and experience and bring an industry-leading test and measurement platform to life.”

Chi partbers left to right: Roland Steffen, Executive Vice President and Head of Test and Measurement Division at Rohde & Schwarz, Jürgen Lang, Director Business Development at FSEU, Brendan Mc Kearney, President at FSEU and Peter Schlindwein, Vice President Corporate Procurement at Rohde & Schwarz.