MIRTEC's New AOI Series Wins a Prestigious Industry Award
MIRTEC announces that it has been awarded the 2012 EM Asia Innovation Award in the category of Test & Measurement / Inspection Systems – AOI for its revolutionary MV-9 3D AOI Series. The award was presented to the company during an April 26, 2012 ceremony in Shanghai during NEPCON China 2012. Established in 2006, the EM Asia Innovation Awards program recognizes top performing companies for achieving the highest standards in the various manufacturing-related products, materials and equipment in Asia.The
MIRTEC’s revolutionary Omni-Vision 3D Inspection System provides true 3D inspection of SMT devices on finished PCB assemblies using a total of four (4) Digital Multi Frequency Moiré Inspection Probes. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured, the new MIRTEC MV-9 machines also feature four 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera.
Brian D’Amico, President of MIRTEC’s North American Sales and Service Division stated: We are very proud to receive the 2012 EM Asia Innovation Award on behalf of MIRTEC’s extremely talented engineering team for their outstanding performance in the design and development of our new MV-9 3D AOI Series. We are confident that this Advanced Technology will not only provide unprecedented speed and performance to the electronics inspection industry, but will undoubtedly set a new standard by which all other inspection equipment will be measured.”