Nordson MARCH Plasma System Technology Displayed at SEMICON Singapore Booth #502

20th April 2012
ES Admin
Nordson MARCH will display its FlexTRAK highly configurable, high-throughput plasma treatment and AP-Series vacuum plasma treatment systems at SEMICON Singapore 2012, booth #502. Plasma performs numerous surface modification processes including surface activation, contamination removal, cross linking, etch by chemical reaction, and physical bombardment for semiconductor, hard disk drive, LED, printed circuit board, medical, and photovoltaic/solar manufacturing.
The Nordson MARCH FlexTRAK Plasma Treatment System provides unparalleled treatment uniformity and process consistency. Its universal architecture accommodates a multitude of material handling configurations to support a wide assortment of variable-size form factors, while its small chamber volume and proprietary process control enable unmatched short cycle times. The slim structure minimizes floor space requirements.

The AP-Series is a versatile line of vacuum plasma treatment systems consisting of four units offering small, mid-size, and large vacuum chamber options that deliver process correlation, controller continuity, and reliable, reproducible vacuum gas plasma treatment to companies as they expand from an R&D environment to various levels of production.

Plasma treatment is an enabling technology that significantly improves quality in many areas of wafer level packaging, and the applications are growing steadily, explained James Getty, president, Nordson MARCH. Nordson MARCH has delivered over 25 years of continuous plasma innovations. We have an expert staff of scientists and engineers and serve the semiconductor industry's most advanced manufacturers. We invite those attending SEMICON Singapore to visit our booth to discuss the cleaning issues that are impacting their business.

Nordson MARCH engineers and scientists will be available to discuss your application at SEMICON Singapore, Marina Bay Sands, Singapore, April 24-26, 2012, booth #502.

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