Practical Components Adds 0.3 mm Pitch Dummy CVBGA Test Vehicle to Lineup
Practical Components introduces a dummy (mechanical sample) version of Amkor’s cutting-edge CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.
The 0.3 mm CVBGA is a 8x8 mm, 368, 0.30 mm solder ball pitch, two-layer thin core substrate with an Ni/Au BGA finish that uses a HL832NX-A (60 µm core) and AUS 410 solder mask.
There is an increasing demand for electronics products that are more compact and offer a higher level of performance, and the 0.3 mm CVBGA dummy component is ideal to train, test and qualify this technology.
Practical Components has 0.3 mm pitch dummy CVBGA components in stock and ready to ship.
The Practical Dummy Component version of the CVBGA is identical to the live package without the expensive IC die inside. The dummy versions are made of the same materials on the same manufacturing lines and have the same size, thermal and soldering properties as the live equivalent without the cost of a live die.
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