Analysis

Collaboration to integrate eSIM innovation

13th June 2018
Alex Lynn
0

A collaboration has been announced by Gemalto that will see its advanced mobile connectivity solutions integrated with Qualcomm Snapdragon mobile PC platform, a product by Qualcomm Technologies, a subsidiary of Qualcomm Incorporated. This paves the way for iSIM commercialisation on a growing range of Always Connected PCs, laptops and tablets.

The effort will support the integration of Gemalto’s eSIM technology and remote subscription management solutions, with the new Secure Processing Unit (SPU) on the Snapdragon mobile PC platform. As a result, this innovation will provide seamless LTE and forthcoming 5G connection, extended battery life, and a foundation for consumer applications such as online payments, transport ticketing and authentication to cloud services. This initiative represents the first time an eSIM will be integrated with processing platforms designed to power Always Connected PCs and similar consumer devices.

Expected benefits for industry players include OEMs optimising their bill of materials and supply chain costs. With Gemalto solutions they facilitate late eSIM customisation during or after the device manufacturing process. Also, ,obile operators benefit from a larger addressable base of connected devices and a trusted platform for secure services. Based on existing standards the technology will be open and secure.

The first wave of Always Connected PCs to incorporate Snapdragon mobile PC platforms featuring Gemalto’s technology are expected in 2019.

“This new agreement with Qualcomm Technologies aims at accelerating adoption of seamless cellular connectivity in PCs, tablets and other mobile products,” said Frédéric Vasnier, Executive Vice President for Mobile and IoT at Gemalto. “We are committed to continued innovation with Qualcomm Technologies in order to provide superior built-in security and connectivity experiences.”

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier