AIM Solder’s Karl Seelig To Present During S12 Technical Session At IPC APEX 2013

The session will cover how reliable solder joint formation depends on the design/paste/printing/reflow process. Weakness in any of these areas means defects and decreased reliability. This session will highlight the choices an assembler has in pastes. Both the flux/vehicle and metal components of solder pastes will be covered. Build on your knowledge base to make the best choices in the quest for reliable solder joints.



In his paper, Mr. Seelig will explain how as the proliferation of modern life electronics continues to drive miniaturization and functionality, electronic designers/assemblers face the issue of environmental exposure and uncommon applications never previously contemplated. This reality, coupled with the goal of reducing the environmental and health implications of the production and disposal of these devices, has forced manufacturers to reconsider the materials used in production.



Furthermore, the need to increase package density and reduce costs, has led to the rapid deployment of leadless packages such as QFN, POP, LGA, and Micro-BGA. In many cases, the manufacturers of these devices will recommend the use of no clean fluxes, due to concerns over the ability to consistently remove flux residues from under and around these devices. These concerns, along with the need to implement a tin whisker mitigation strategy and/or increase environmental tolerance; have led to the conundrum of applying conformal coating over no clean residues.



The AIM Research & Development Department has united with OEM electronics and conformal coating manufacturers in an attempt to characterize the different coating technologies currently available. In this study, various coating materials were tested with different chemistries of no clean fluxes. Results demonstrate possible combinations meeting the mission profile of the assembly with consideration for the assemblers’ capabilities and cost objectives.



For a more comprehensive look at this topic, stop by technical session S12.