Analysis

3.2-megapixel and 2.0-megapixel CMOS image sensors

17th October 2006
ES Admin
0
Toshiba Electronics Europe has announced the further expansion of its Dynastron CMOS image sensor product line with the addition of two new devices: the 3.2-megapixel ET8EE6-AS CMOS image sensor and 2.0-megapixel ET8EF2-AS CMOS image sensor SoC with integrated image-signal processor (ISP).
With a pixel pitch of just 2.2 microns, a significant advance in cell-size miniaturisation compared to the 2.7-micron pixel pitch of previous 2- and 3.2-megapixel products, the new devices enable development of smaller, space-saving camera modules for cellular phones and other camera-enabled mobile devices.

Toshiba engineers were able to reduce the pixel pitch in both image sensors from 2.7 microns to 2.2 microns while retaining a pixel size capable of recording high-resolution images. With the ET8EE6-AS, Toshiba reduced a 3.2-megapixel image sensor to a 1/3.2 optical format, an improvement over the company’s previous 1/2.6-inch format size. ET8EF2-AS achieves a 2.0-megapixel count in a 1/4-inch optical format.

The new sensors also offer low-power consumption, smearless imaging and high-speed operation, all essential requirements for personal mobile equipment, including camera phones and personal media centres. (A smear is a vertical stripe in an image and can occur in bright-light conditions, such as direct sunlight.). The ET8EF2-AS also integrates an ISP for sophisticated picture effects and advanced camera operations, such as digital zoom, windowing, image downsizing and picture flip.



Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier