News & Analysis
Waytronx Acquires Privately Held Japanese Electronics/Distribution Conglomerate
Waytronx, Inc. today announced that, effective July 1, 2009, it has acquired Comex Instruments Ltd and 49% of Comex Electronics Ltd, along with the associated distribution network, both Japanese based providers of electronic components.
Mirics appoints Jay Nunez to drive business development
Mirics Semiconductor has appointed Jay Nunez as VP Americas and EMEA to spearhead the company’s commercial growth in these two mature and lucrative regions of the world. Nunez was previously VP North American Sales and Marketing for processor company Advanced Micro Devices (AMD), having originally served graphics chip specialist ATI Technologies as VP World Wide OEM Sales prior to its merger with AMD.
Peregrine Semiconductor and MagnaChip Complete Final Qualification on UltraCMOS Technology Transfer
Peregrine Semiconductor and MagnaChip Semiconductor Ltd., a leading Asia-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications, today, announced that the companies have completed the final qualification phase in the process technology transfer of Peregrine’s UltraCMOS SOS (Silicon-On-Sapphire) technology to MagnaChip’s Cheongju wafer manufacturing facility.
Video surveillance product provides improved image quality while reducing storage and bandwidth needs
Storage space and bandwidth needs have historically presented a roadblock for video surveillance customers. As different image sizes need to be extracted at various frame rates, intelligent video compression is a necessity. Offering video surveillance customers the ability to optimize their bandwidth needs and reduce storage space, GE Security announces the new VisioWave Intelligent Video Platform (IVP) product line based on digital media process...
CUI Inc Names Mark Adams As Its New Vice President Of Worldwide Sales
Waytronx has announced that Mark Adams has joined its wholly owned subsidiary, CUI, Inc., as Vice President of Worldwide Sales. He is currently focused on identifying, acquiring, and managing a global sales representative network. Prior to his arrival at CUI, Adams was a sales and product development leader in the semiconductor industry with more than 17 years of experience. He has acquired and managed major accounts such as Cisco Systems, Junip...
Broadcast Video Test Equipment Maker PHABRIX Selects National Semiconductor’s 3-Gbps SDI Family
National Semiconductor has announced that PHABRIX Limited, a leading provider of portable broadcast test equipment based in the U.K., has incorporated five National signal conditioning and data conversion products into the industry’s first handheld test and measurement device to support comprehensive 3G/HD/SD eye pattern rendering and jitter measurement to the Society of Motion Picture and Television Engineers (SMPTE) standards.
Fujitsu and N-trig Partner to Help Make Hands-On Computing Faster and More Fun for Users
Fujitsu Microelectronics and N-trig have announced they have reached an agreement to co-operate on N-trig's next-generation chipset, to be developed by N-trig and manufactured by Fujitsu Microelectronics. The combined efforts of the two technology leaders will provide both the consumer and enterprise markets with the best pen and multi-touch computing experience with multiple simultaneous touch points being recognised.
Molex gets Best Technical Support Award from Huawei Technologies
Molex Incorporated has been presented with the 2008 “Best Technical Support” award by Huawei Technologies Co. Ltd., a leader in providing next generation telecommunications network solutions for operators around the world. The award recognises Molex’s continued assistance to and support of Huawei’s R&D team in providing timely and professional technical advice and strong sales and customer service for Huawei’s ne...
IDT Completes Acquisition Of Tundra Semiconductor
IDT has announced it has completed its acquisition of Tundra Semiconductor Corporation. The Tundra acquisition strengthens the IDT product portfolio of serial switching and bridging using PCI Express, Rapid IO and VME interconnect standards. Additionally, the Tundra technology, combined with the IDT mixed signal product portfolio and channel capabilities, will further reinforce the IDT leadership in interconnect solutions for the communication, c...
CIL's investment in micro-packaging pays dividends
CIL is reaping the benefit of new investment in micro-packaging manufacturing techniques. When CIL was formed in 1987, the company began by working in the field of ceramic hybrid design and small volume manufacture and this has helped to develop a deep understanding of all aspects of materials and assembly methods.