News & Analysis
Micron Technology Expands China Manufacturing Operations
Micron Technology, Inc. (Nasdaq:MU), today announced the expansion of its operations in Xi'an, China, commemorated at a ceremony attended by government, community and company leaders. The expansion involves the completion of Micron's second semiconductor Test and Module Assembly building to complement its existing facility in Xi'an.
Intel, Micron Extend NAND Flash Technology Leadership, Introduce Industry's Smallest, Most Advanced 20-Nanometer Process
Intel Corporation and Micron Technology Inc. today introduced a new, finer 20-nanometer (nm) process technology for manufacturing NAND flash memory. The new 20nm process produces an 8-gigabyte (GB) multi-level cell (MLC) NAND flash device, providing a high-capacity, small form factor storage option for saving music, video, books and other data on smartphones, tablets and computing solutions such as solid-state drives (SSDs).
Zarlink Delivers Strong Fiscal 2011 and Fourth Quarter Results
Annual revenue increases to $230.2 million, up 13% or $25.6 million year-on-year, driven by accelerating demand for timing and line circuit products Company delivers fourth quarter revenue at the high-end of guidance, gross margin improves to 53%
Littelfuse Co-Sponsors First Chinese Driver to Enter Indy 500
Littelfuse announced today that it will join Mouser Electronics, a design engineering resource and global distributor for semiconductors and electronic components, in sponsoring Ho-Pin Tung as he enters the qualifying races for the Indianapolis 500 this weekend. If Tung, who has completed a test run topping 220 miles per hour, succeeds in qualifying for the race, he will be the first Chinese national to compete in this event.
Ramtron Ships First F-RAM Samples Built on New IBM Manufacturing Line
Ramtron International announced broad sampling of the first pre-qualification ferroelectric random access memory (F-RAM) devices built on the company's new manufacturing line at IBM Corporation (NYSE: IBM). The FM24C04C and FM24C16C are serial 5-volt devices with 4- and 16-kilobits of F-RAM memory, respectively. The devices offer a high-performance nonvolatile data collection and storage solution for electronic systems. Ramtron’s F-RAM products...
Korenix offers a Cost-effective approach for real-time forest monitoring and early fire detection with Booster PoE Switches & High Performance 802.11a Wireless APs
Korenix JetNet 3810G booster PoE switches and JetWave 2610 wireless APs have been integrated in a large network infrastructure for providing real time surveillance, fire monitoring and detection of the forests in an energy efficient way. Using the built-in 24V booster PoE ports, the switches were capable to convert the power source from the solar panels for driving the 48V PoE-enabled devices, ensuring reliable Ethernet connection while minimizin...
Robust and low-cost multi-touch interfaces
andersDX and Baanto International Announce Strategic Technology Partnership for mid-large sized Touch Interface Solutions. The Partnership brings together advanced display & embedded computing solutions with revolutionary ShadowSense optical 2D and 3D multi-touch technology
Double Output – A New Digitaltest Success Story for Condor
EKM Elektronik GmbH & Co. KG is a German subcontractor, offering a broad range of production services to the European market with more than 90 employees including; • Board assembly in leaded and lead-free technology; • Repair of PCB assemblies; • Protective coating of PCB assemblies using a range of conformal coatings • Encapsulation of assemblies; • Cleaning of PCB assemblies
Lab X Technologies Issues AVB Platform License to Biamp Systems
Lab X Technologies, a connectivity provider and engineering design resource specializing in Audio Video Bridging (AVB) technologies, has granted Biamp Systems® a license to utilize its IEEE 802.1 AVB Audio Platform for use on Xilinx FPGAs. Lab X’s AVB Audio Platform offers manufacturers high-channel capacity audio implementation based on the international standards of networked connectivity.
Imec processes first power devices on 200mm CMOS-compatible GaN-on-Si
Imec and its partners in the GaN industrial affiliation program (IIAP) have produced device-quality wafers with GaN/AlGaN layers on 200mm silicon wafers. With these wafers, functional GaN MISHEMTs were processed using standard CMOS tools.