News & Analysis
“By 2017, the ratio of thin wafers vs. total number of wafers will be 74% in 12’’eq.”
Yole Développement announces its webcast Thin Wafer Applications & Related Technologies. This online event takes place on Nov. 14 at 8.00 AM PST. The webcast is sponsored by EV Group and powered by I-Micronews.com. With more than 330 registrations today, this webcast is a promising event, where attendees and speakers will exchange about the latest market trends and technologies innovation.
congatec 22nd fastest growing German technology company
congatec has been ranked the 22nd fastest growing technology company in Germany in this year’s Deloitte Technology Fast 50 awards. Rankings are based on the percentage of revenue growth over the last five years, 2007-2011. congatec achieved a growth of 293 percent during this period.
congatec announces record quarterly earnings for Q3/2012
congatec has concluded the third fiscal quarter of 2012 with record results. Sales rose to €16.7 million, corresponding to an increase of 43% compared with Q3/2011. congatec’s growth is not limited to financial performance; the number of employees has also increased by 11 in the current year, bringing the worldwide total to 135.
Invotec Reveals €1m Investment in Tamworth Facility
Invotec announces today that it is making a €1m investment in upgrading the capability of its Tamworth facility. A key feature of the investment programme will be the installation of an Orbotech Paragon 9800i LDI system, set for delivery in November. Offering high speed automated imaging of HDI, Flex, Rigid-Flex and Solder-Mask applications, the unit will ensure high yields while satisfying tight registration accuracy requirements.
Imec and Holst Centre to Present Research Breakthroughs at ISSCC
Imec and Holst Centre announced today that they will present nine papers at the 60th International Solid-State Circuits Conference, February 20-24, 2013 in San Francisco. ISSCC is the foremost global forum on advancements in solid-state circuits and systems on a chip.
NI Instrument Driver Network Reaches 10,000 Drivers for Automating Stand-Alone Instrumentation
National Instruments today announced that the NI Instrument Driver Network has reached a new milestone of 10,000 instrument drivers for automating stand-alone instrumentation. From IDNet, you can access free, NI-certified instrument driver downloads for NI LabVIEW system design software, NI LabWindows/CVI and Microsoft Visual Studio.NET. IDNet instrument drivers simplify instrument control across a variety of buses including GPIB, USB, PXI, PCI, ...
Supermicro FatTwin Delivers 16% Net Power Savings to Transform the HPC Landscape
Super Micro Computer will showcase its expansive lineup of SuperServer, SuperStorage and networking solutions geared for high performance computing at Supercomputing 2012 in Salt Lake City, Utah, November 12-15.
Cavium & Symmetricom Partner to Enable IEEE 1588 Precision Timing for Small Cell Base Stations
Cavium and Symmetricom today announced a collaboration to ensure that 3G and 4G/LTE networks maintain mission critical synchronization. Symmetricom’s SoftClock fully supports both the IEEE 1588 Precision Time Protocol standard as well as the Network Time Protocol and has now been certified for operation on Cavium’s OCTEON Fusion, the industry's most powerful base station-on-a-chip family of SoC’s, enabling joint customers to fur...
Nanosolar Completes 10.63 MW Solar Installation in Valencia
Nanosolar today announced its largest solar photovoltaic installation to date, a 10.63 MW project in the town of Alfarrasi, which is located in the Valencia region of Spain. Developed by Smartenergy Invest and Advanta Capital, the new solar field is now the region’s largest PV power plant to date. The plant was energized earlier this month and is expected to produce energy to power 4,000 households per year.
Automation Innovations at SPS/IPC Drives from TE Connectivity
With 60 years of knowledge and industry experience, TE Connectivity is pleased to participate at the upcoming SPS/IPC Drives 2012 tradeshow in Nuremberg, Germany. At its booth # 332 in hall 10, TE will showcase the new Deutsch heavy-duty connector portfolio. With the acquisition of Deutsch earlier this year, TE has expanded its long-standing range of rectangular connectors to include circular connectors and industry-standard connector systems.