Making a debut at embedded world in Nuremberg (February 26-28) is Octavo Systems’ OSD32MP1, a System-in-Package (SiP) product based on the STM32MP1 microprocessor from STMicroelectronics. The OSD32MP1 allows users of the STM32 family to move to Linux without adding size or complexity to their design.
Octavo has leveraged their years of experience creating tightly integrated system building blocks to develop a device that is up to 64% smaller than an equivalent system made from discrete components. At only 18mm X 18mm the OSD32MP1 is the same size as the STM32MP1 but integrates the STM32MP1 microprocessor, STPMIC1 Power Management IC (PMIC), up to 1GB of DDR3 memory, 4K non-volatile EEPROM, MEMs oscillators, and over 100 passives into a single BGA package.
The new STM32MP1 contains Dual Arm Cortex-A7 microprocessors along with an Arm Cortex-M4 microcontroller. It has a wide range of peripherals spanning from two 22 Channel ADCs, to a camera interface, to 1Gbps ethernet, to a 3D GPU, making it a great fit for remote sensors, HMI displays, motor control applications, medical systems, and IoT end points.
The integration provided by the OSD32MP1 SiP makes the solution ideal for any application needing a versatile applications processor in a small package.
“The continued push of IoT and the demand for more data has required many applications to migrate from an existing microcontroller design to one based on a microprocessor running Linux. There are usually two major hurdles that prevent this from being an easy transition; porting their application, and complicated hardware designs,” comments Greg Sheridan, Marketing Manager at Octavo Systems. “Integrating the new STM32MP1 into the OSD32MP1 removes these roadblocks, greatly reducing the effort required to migrate from a microcontroller to a microprocessor running Linux.”
Beyond simplifying the design process, the OSD32MP1 brings all the other benefits of System-in-Package to this new set of designs. These benefits include lower cost Printed Circuit Boards (PCBs) by requiring less space and needing less complicated manufacturing processes, like Laser Vias or Via-in-Pad.
The OSD32MP1 also simplifies the task of sourcing components by integrating over 100 devices from multiple vendors into a single component.
“Having ST ask us to be one of their partners at launch really validates our vision for the future of electronics design. Designers will demand more integrated solutions to start to develop their unique applications faster rather than spend time on tedious tasks that don’t differentiate their product,” adds Gene Frantz, CTO Octavo Systems. “System-in-Package is the solution to provide this tremendous level of integration.”
Design resources for the OSD32MP1 are available on the Octavo Systems website. Samples will be available in Q3 with full production scheduled for Q4. “Pricing is still being finalised and will be in-line with the cost of an equivalent system designed with discrete components,” said Greg.
To further help customers start developing with the OSD32MP1 Octavo Systems is proud to announce ISMOsys (Integrated Sales Marketing and Operations) as its official pan European Representative.