Duo hoping to strengthen microelectronics innovation

29th June 2017
Source: CEA / Leti
Posted By : Alice Matthews
Duo hoping to strengthen microelectronics innovation

Research institute of CEA Tech in Grenoble, France, Leti, and the Berlin-based Fraunhofer Group for Microelectronics, Europe's largest R&D provider of smart systems, will initially focus on extending CMOS and More-than-Moore technologies to enable next-gen components for applications in the Internet of Things, augmented reality, automotive, health, aeronautics and other sectors, as well as systems to support French and German industries.

The agreement was signed today by Leti CEO Marie Semaria and Fraunhofer Group for Microelectronics Chairman Hubert Lakner during Leti Innovation Days, which are marking Leti's 50th anniversary.

"The ability to, one, develop key enabling technologies that overcome the formidable technical challenges that our leading technology companies will face, and, two, transfer them quickly to industry, is an essential focus for research institutes and industrials in France and Germany," Semeria said. "Building on our previous, successful collaborations, Leti and the Fraunhofer Group for Microelectronics will bring our complementary strengths to the task of keeping France and Germany's microelectronics industries in the forefront – and offer our innovations across Europe."

"Micro-/nanoelectronics and smart systems are key enabling technologies for the economic success of Europe, especially in France and Germany. Thus, Europe can no longer afford to scatter its research competences. For the benefit of industry, joining forces will become more and more important, not only for industry but also for RTOs," Lakner explained. "The new cooperation agreement will be the starting point for a strategic research cooperation of the two countries in order to jointly support the upcoming EC initiative, Important Project of Common European Interest (IPCEI), on micro- and nanoelectronics."

Specific R&D projects that the collaboration will focus on include:

  • Silicon-based technologies for next-gen CMOS processes and products, including design, simulation, unit process and material development as well as production techniques
  • Extended More than Moore technologies for sensing and communication applications
  • Advanced-packaging technologies.

The second phase of the collaboration may be expanded with additional academic partners and other countries, as needed.


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Building IoT products for smart healthcare market
8th February 2018
United Kingdom Cocoon Networks, London
Smart Mobility Executive Forum
12th February 2018
Germany Berlin
Medical Japan 2018
21st February 2018
Japan INTEX Osaka
Mobile World Congress 2018
26th February 2018
Spain Barcelona
embedded world 2018
27th February 2018
Germany Nuremberg