A new monolithic high-speed, low-voltage CMOS double data rate 3 synchronous DRAM (DDR3L SDRAM) with an 8-Gb density in the 96-ball, 9-mm by 14-mm, lead (Pb)-free FBGA package from Alliance is available at MSC Technologies.. Featuring silicon provided by Micron Technology, the AS4C512M16D3L (512M x 16) offers a double data rate architecture for extremely fast transfer rates of up to 1600Mbps/pin and clock rates of 800MHz.
With minimal die shrinks, the single-die 8Gb DDR3L SDRAM provides a reliable drop-in, pin-for-pin-compatible replacement for a number of similar solutions used in conjunction with newer-generation microprocessors for industrial, medical, networking, telecom, and aerospace applications - eliminating the need for costly redesigns and part requalification.
The device can be used by customers that require increased memory yet face board space constraints.
The AS4C512M16D3L operates from a single +1.35V power supply and is available with a commercial temperature range of 0 to +95°C (AS4C512M16D3L-12BCN) and an industrial temperature range of -40 to +95°C (AS4C512M16D3L-12BIN).
The device is internally configured as eight banks of 512M x 16 bits.