rive combines Greenliant’s internally developed NAND controller with NAND flash die for a fully integrated SSD in a multi-chip package. SATA and PATA NANDrive products have the same pin-out across all capacities in each family to ensure backward compatibility and simplify board design. The BGA package allows for easy and firm mounting to a system motherboard, and the 1mm ball pitch increases long-term reliability for applications enduring mechanical shock, vibration and temperature cycling.
“Greenliant has optimized its NAND controllers and NANDrive production flow to ensure quality and reliability requirements, such as avoiding uncorrectable errors, when the MLC NAND is operating at extremely low and high temperatures,” said Frank Lin, vice president of engineering, Greenliant Systems. “Through this technology advancement, we can now offer I-temp NANDrive, a cost-effective embedded SSD for cost-competitive applications that require extended reliability over extended temperature ranges.”
“MLC NAND is difficult to manage, and even more difficult over wide temperature ranges. Until now, embedded systems that required industrial temperature solid state storage had to use more expensive SLC NAND,” said Jim Handy, principal analyst, Objective Analysis. “Greenliant's NANDrive solution promises to bring pricing of industrial temperature SSDs to reasonable levels.”
The addition of MLC NAND-based industrial temperature NANDrive devices builds on Greenliant’s high-endurance industrial grade product offerings, giving customers more choices and flexibility when selecting embedded SSDs to meet their design needs.
Greenliant is currently sampling industrial temperature GLS85LS
SATA and GLS85LP
PATA NANDrive devices in 8, 16, 32 and 64 GByte with customers on select product engagements.