A new line of NVM Express (NVMe) SSDs have been launched by Toshiba Electronics Europe (TEE). Integrating 64-layer, 3D flash memories, the XG5 series offers up to 1TB capacity in a compact M.2 form factor. Starting today, OEM customers will have access to limited quantities of qualification samples with shipments gradually increasing in the second half of 2017.
As the third generation of the popular Toshiba XG Series, XG5 SSDs feature the latest 3-bit-per-cell TLC (triple-level cell) BiCS FLASH and utilise PCI EXPRESS (PCIe) Gen3 x 4 lanes and NVMe Revision 1.2.1 to deliver high performance up to 3,000MB/s of sequential read and 2,100MB/s of sequential write. Compared to 6Gbit/s SATA storage, the XG5 Series is up to 5.4 times faster on sequential read performance and up to 3.8 times faster on sequential write performance with a maximum interface bandwidth of 32GT/s.
Additionally, XG5’s feature-set also features an SLC cache for performance to accelerate burst type workloads, such as those experienced routinely on Windows-based PCs, as well as improved standby power consumption reduced by over 50% to less than 3mW, making these SSDs a suitable solution for high performance mobile computing.
XG5 Series SSDs will be available in three capacities, 256, 512 and 1,024GB, all on a single-sided M.2 2280 form factor. Self-encrypting drive (SED) models supporting TCG Opal Version 2.01 will also be offered, making the XG5 series suited to a wide range of applications including ultra-mobile PCs that prioritise performance and business applications requiring security.
The XG5 series SSDs will be showcased at COMPUTEX TAIPEI 2017 in Taipei, Taiwan, from 30th May to 3rd June.