Memory
mSATA SSDs provide read/write speeds of 525 & 450MB/s
Swissbit has launched its next-gen X-60m Series mSATA SSD product family. Compliant with the latest SATA III (6.0 Gb/s) interface specification, these reliable drives deliver high performance in demanding industrial, network, comms and automotive sectors. X-60m drives are compliant with JEDEC MO-300A (50.8x29.85x3.5mm) and suited for embedded applications needing high performance, non-volatile SSD storage in a compact, removable form-factor.
High speed CMOS DDR2 SDRAM features high 2Gb density
Alliance Memory has broadened its lineup of high-speed CMOS DDR2 SDRAMs with a device featuring high 2Gb density in the 84-ball 8x12.5x1.2mm FBGA package. Available from a very limited number of suppliers, the AS4C128M16D2 is offered in commercial (0 to +85°C) and industrial (-40 to +95°C) temperature ranges.
Ideas are bubbling for more efficient computer memory
Researchers at UCLA and the U.S. Department of Energy’s Argonne National Laboratory have announced a new method for creating magnetic skyrmion bubbles at room temperature. The bubbles, a physics phenomenon thought to be an option for more energy-efficient and compact electronics, can be created with easy-to-use equipment and common materials.
SPI NOR flash memories meet AEC-Q100 certification
A new series of AEC-Q100-certified SPI (Serial Peripheral Interface) multiple-I/O NOR Flash memory ICs from AMIC Technology is available at Solid State Supplies. Specified for operation over the –40 to +125°C temperature range, the addition of AEC-Q100 certification for the AMIC A25L series of 3V SPI NOR Flash devices makes them ideal for automotive and other industrial applications.
Workshop looks at innovative memory technologies
CEA-Leti is hosting its seventh workshop on innovative memory technologies, following the 17th annual LetiDays Grenoble on the 24th and 25th of June at the Minatec campus. Topics at LetiWorkshop Memory on the 26th of June will range from short-term to long-term memory solutions.
8Gb-based DDR4 memory modules offer cost advantages
DDR4 2400MT/s 8Gb-based RDIMM, LRDIMM, and ECC UDIMM server modules are now being sampled by Crucial through its Technology Enablement Program. Engineered to enable higher density modules, 8Gb-based DDR4 memory allows for increased performance, bandwidth, and energy efficiency.
8Gb components enable DDR4 16GB memory modules
Designed for those who deal with content creation, virtual machines, RAM drives, and memory-intensive applications, the Ballistix DDR4 16GB performance memory modules have been released by Crucial. The devices leverage Micron’s 8Gb DDR4 component technology to offer up the highest density DDR4 memory to date.
Synchronous SRAMs with ECC are 'industry's highest-density'
Synchronous SRAMs claimed to be the industry’s highest-density have been released by Cypress Semiconductor. The integrated ECC feature enables the new 36Mb synchronous SRAMs to provide the highest levels of data reliability, simplifying designs for a wide variety of military, communication and data processing applications.
F-RAMs provide 100tn read/write cycle endurance
A family of 4Mb serial Ferroelectric Random Access Memories (F-RAMs), claimed to be the industry’s highest density, have been introduced by Cypress Semiconductor. The 4Mb serial F-RAMs feature a 40Mhz SPI, a 2.0-3.6V operating voltage range and are available in industry-standard, RoHS-compliant package options. All F-RAMs provide 100tn read/write cycle endurance with 10-year data retention at 85°C and 151 years at 65°C.
TLC NAND provides efficient, high-performance storage
Micron Technology announced a recent addition to its expansive portfolio of flash storage products, providing a purpose-built solution for cost-sensitive consumer applications seeking high performance and reliability. The TLC (Triple-Level Cell) NAND is built on its 16nm process and delivers a balanced set of features for applications like USB drives and consumer solid state drives.