Memory
SMART modular selects IDT as a preferred partner
Integrated Device Technology has announced that SMART Modular Technologies has chosen IDT as a preferred partner for its DDR4 NVDIMM (non-volatile dual in-line memory module) product. The offering includes the 4RCD0124K registered clock driver (RCD) and TSE2004GB2 thermal sensor with SPD, which are part of IDT’s NVDIMM chipset. The chipset is the only complete DDR4 NVDIMM solution available on the market and has been customer qualified and ...
Ultra small package option benefits 1Mb SPI FRAM device
Distributor Rutronik has announced that it now stocks Fujitsu’s ultra small package option for the company's 1Mb SPI FRAM device, offering a solution for power critical miniature applications in sensor and wearable markets. This miniature 8 pin wafer level chip scale package (WL-CSP) is an additional package variant to the existing product MB85RS1MT.
SPI FRAM comes in ultra small package
A new ultra small package for Fujitsu’s 1Mbit SPI FRAM device is available at distributor Rutronik as of now. It is the ideal solution for power critical miniature applications in sensor and wearable markets. This new miniature 8 pin wafer level chip scale package (WL-CSP) is an additional package variant to the existing product MB85RS1MT.
HDDs suit mission-critical high-availability storage
Toshiba Electronics Europe has announced its latest enterprise performance HDD line, the AL14SE series, designed for mission critical servers and high-performance, high-availability storage systems. The AL14SE is Toshiba’s latest 10,500rmp HDD to support 12.0Gb/s SAS and 512n sector length for compatibility with the latest generation host controllers and host bus adapters.
NAND flash memories are serial interface compatible
A line-up of 24nm SLC NAND flash memory products for embedded applications that are compatible with the widely used Serial Peripheral Interface (SPI) has been unveiled by Toshiba Electronics Europe. Wide ranging applications for the Serial Interface NAND include consumer applications such as flat-screen TVs, printers, wearables and industrial applications including industrial robots.
Memory module supports LPDDR5 standard
Cadence has announced the Cadence Memory Model for the LPDDR5 standard. This Verification IP (VIP) product enables engineers to verify that SoC designs are compliant with the JEDEC interface standard, and that they can operate correctly in a system with the actual memory components. Validation of designs using the LPDDR5 memory model reduces the risk of mistakes, rework and delayed production, leading to faster production ramp-up and higher produ...
Is this the industry's fastest SPI NOR flash memory?
Macronix has announced what is claimed to be the industry's fastest SPI NOR flash memory, the OctaFlash MX25UM product family. OctaFlash provides designers with the next-gen performance level of x8 I/O serial interface products with an operating frequency of up to 200MHz and transmission speeds of up to 400MB/s. This world class leading performance aids designers to meet the ever increasing demands of In-vehicle entertainment, ADAS & camera a...
eHDDs & eSSDs earn VMWare 6.0 certification
Toshiba Electronics Europe announces that its 12Gb/s SAS 15,000 RPM enterprise HDDs - the AL13SX Series - and eSSDs - PX03SN Series - have earned VMware Virtual SAN 6.0 and 5.5 certification for VMware vSphere environments. Virtual SAN for VMware vSphere 6.0 is a hypervisor-converged storage platform that was released in March to deliver the benefits of software-defined storage to the data centre.
Designing electric & magnetic order for low-energy computing
Scientists at the University of Liverpool have developed a new material that combines both electrical and magnetic order at room temperature, using a design approach which may enable the development of low-energy computer memory technologies.
Low-Voltage CMOS DDR3L SDRAM runs at 800MHz
A new monolithic high-speed, low-voltage CMOS double data rate 3 synchronous DRAM (DDR3L SDRAM) with an 8-Gb density in the 96-ball, 9-mm by 14-mm, lead (Pb)-free FBGA package from Alliance is available at MSC Technologies.. Featuring silicon provided by Micron Technology, the AS4C512M16D3L (512M x 16) offers a double data rate architecture for extremely fast transfer rates of up to 1600Mbps/pin and clock rates of 800MHz.