Memory
Memory interface designed for instant-on applications
Cypress Semiconductor has announced the inclusion of its high bandwidth HyperBus 8-bit serial memory interface into the new eXpanded SPI (xSPI) electrical interface standard from the JEDEC Solid State Technology Association. The xSPI standard defines requirements for the compatibility of high performance eight times serial interfaces, enabling controller and chipset manufacturers to design a universal memory controller.
Low voltage SDRAMs feature a DDR architecture
Alliance Memory has announced that it has expanded its high speed CMOS DDR3 and low voltage DDR3L SDRAMs with new 512Mb 8 times and 16 times devices in the 78-ball and 96-ball FBGA packages, respectively. Featuring a DDR architecture, the SDRAMs provide fast transfer rates of 1,600Mbps and clock rates of 800MHz.
F-RAM memory enables mission-critical data capture for IIoT applications
Cypress Semiconductor has announced that MikroElektronika (MikroE), an embedded systems retailer, has selected Cypress' 4Mb serial Ferroelectric Random Access Memory (F-RAM) to be included on its newest click board with a mikroBUS socket. The FRAM 2 click board is a compact, plug-and-play solution designed to evaluate the data logging and processing capabilities of Cypress F-RAMs, and the board enables faster prototyping and development of I...
SoC memory improvements highlighted at IEDM 2017
A research institute of CEA Tech, Leti, demonstrated significant improvements in the field of memory systems at IEDM 2017. These improvements included reconfiguring Static Random-Access Memory (SRAM) into Content-Addressable Memory (CAM), improving non-volatile crossbar memories and using advanced Tunnel Field-Effect Transistors (TFET).
Enterprise performance HDD model for mission-critical servers
The AL15SE series HDD has been announced by Toshiba Electronics Europe, its next-gen of 10,500rpm enterprise performance hard disk drives for mission-critical servers and storage. The new drive series boasts a 2,400GB capacity model – a 33% capacity increase over Toshiba’s AL14SE generation and Toshiba’s largest capacity ever for a 10,500rpm HDD.
UFS 2.1-compliant flash memory for automotive applications
Sample shipments of Toshiba Memory Europe's embedded NAND flash memory products for automotive applications that are compliant with JEDEC UFS version 2.1 have begun. The new products meet AEC-Q100 Grade 2 requirements, support the wide temperature range of -40 to 105°C, and offer the enhanced reliability capabilities that are required by increasingly complex automotive applications.
NVMe SSDs increase performance and double capacity
The XG5 lineup of NVMe solid state drives (SSDs) from Toshiba Memory Europe that are based on its 64-layer, 3D BiCS FLASH memory has been expanded. The new XG5-P is a premium sub-series that doubles the capacity and is tuned to improve full access range random read/write performance by up to 55% over standard XG5 SSDs.
High-end storage platform for enterprise and telecom applications
A 2U rackmount network appliance has been released by Lanner, built with Intel Xeon Processor Scalable Family (Skylake-SP) and Intel C621/C627 chipset. Cloud-based storage is an increasing necessity for today’s businesses and telecommunications needs, and the FX-3230 is a secure, high-performance and high-capacity storage gateway appliance that meets such demand.
Renesas achieves large-scale memory operation
Supplier of advanced semiconductor solutions, Renesas Electronics, has announced that it has successfully confirmed large-scale memory operation in a split-gate metal-oxide nitride oxide silicon (SG-MONOS) process using fin-shaped 3D transistors for use in microcontrollers (MCUs) with on-chip flash memory having a circuit linewidth of 16 to 14nm or finer.
14TB HDD fits into standard 3.5" SATA drive bays
Toshiba Electronics Europe has announced the launch of the MG07ACA series, which it claims to be the world’s first enterprise 14TB Conventional Magnetic Recording (CMR) HDD. Using a 9-disk, helium-sealed design, the new MG07ACA series provides the power-efficient capacity and storage density needed by cloud-scale and enterprise storage solution providers to achieve their TCO objectives.