Memory
RAM technology targets high reliability automotive applications
Provider of innovative application-specific semiconductors for the IoT era, Adesto Technologies has announced it will present new research showing the significant potential for Resistive RAM (RRAM) technology in high reliability applications such as automotive. Adesto Fellow Dr. John Jameson, who led the research team, will share the results at the ESSCIRC-ESSDERC 48th European Solid-State Device Research Conference, being hel...
Secure memory solutions from Berlin
Industrial-grade flash memory solutions manufacturer, Swissbit, has been chosen as a volume production partner for Norwegian high-end-encryption solutions provider Hiddn Solutions ASA. The two memory experts agreed to locate series production of Hiddn product solutions at Swissbit’s manufacturing facility in Berlin, Germany.
Mouser inks global deal with Micron Technology
Mouser Electronics has signed a global distribution agreement with Micron Technology. It adds a key memory technology manufacturer to Mouser’s portfolio. Micron products target a broad array of applications in the computing, networking, data, server, mobile, embedded, consumer, automotive, and industrial markets.
Industry’s first SSD using 96-layer 3D flash memory
Toshiba Electronics Europe has introduced a new lineup of solid state drives (SSDs) that are based on its 96-layer, BiCS FLASH 3D flash memory. Reportedly the first SSD to use this technology, the new XG6 series is targeted to the client PC, high performance mobile, embedded, and gaming segments, as well as datacentre environments for boot drives in servers, caching and logging, and commodity storage.
Artificial intelligence SSD controller architecture solution
At the Flash Memory Summit, Marvell demonstrated how it will provide artificial intelligence capabilities to a broad range of industries by incorporating NVIDIA’s Deep Learning Accelerator (NVDLA) technology in its family of data centre and client SSD controllers.
Innovative EDSFF data storage solutions at Flash Memory Summit
Reference design solutions for emerging enterprise data centre SSD form factor (EDSFF) implementations have been announced by Marvell. Addressing the growing need within the data centre and enterprise sectors for more densely packed, higher capacity SSDs, these EDSFF reference designs are powered by the company’s latest PCIe Gen 3x4 SSD controller ICs.
Addressing high bandwidth storage needs
It has been announced by Microsemi Corporation that they are introducing the new SXP 24G family of devices, 24G SAS (SAS-4) expanders for server and networked storage. 24G SAS doubles the bandwidth of the storage interconnect, which enables the full bandwidth of the PCIe Gen 4 to be utilised by the storage interconnect.
Multi-project wafer service with integrated silicon OxRAM
Research institute at CEA Tech, Leti, and CMP, a service organisation that provides prototyping and low volume production of ICs and MEMS, have announced the multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base wafer platform.
Memory-processing unit could bring memristors to the masses
A new way of arranging advanced computer components called memristors on a chip could enable them to be used for general computing, which could cut energy consumption by a factor of 100. This would improve performance in low power environments such as smartphones or make for more efficient supercomputers, says a University of Michigan researcher.
Win a Microchip serial memory single-wire EEPROM evaluation kit
Win a Microchip Serial Memory Single-Wire EEPROM evaluation kit (DM160232). The serial memory single-wire evaluation kit is an easy to use interactive user tool, which demonstrates functionality and low power operation of the AT21CS series of serial EEPROM devices.