Memory

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Storage class memory solution to reduce latency

Storage class memory solution to reduce latency
  Toshiba Memory has announced the launch of a new Storage Class Memory (SCM) solution: XL-FLASH. Based on the company’s innovative BiCS FLASH 3D flash memory technology with 1bit-per-cell SLC, XL-FLASH brings low latency and high performance to data centre and enterprise storage.
6th August 2019

Introducing the SMC 1000 8x25G serial memory controller

In this video, Jay Bennett, Product Marketing Manager from Microchip explains that the company is entering the memory infrastructure space with the first member of the smart memory controller product family, the SMC 1008.
6th August 2019

3D-NAND and secure memory solutions for demanding applications

3D-NAND and secure memory solutions for demanding applications
Swissbit will be returning to Flash Memory Summit (FMS) in Santa Clara, California from 6th to 8th August, 2019. During the show, Swissbit will be showcasing its latest 3D-NAND-based industrial storage product range (X 75) in conference room #208. Swissbit will also be presenting memory cards with integrated security features and demonstrating the concept of a net-policy-server for control and management of flash memory as an authentication token and boot device.
29th July 2019


Industrial-grade SSD functions in wide temperature range

Industrial-grade SSD functions in wide temperature range
Apacer is adding a new series to its comprehensive product line. The 3D TLC SV250 SSD is now available for buyers who need the highest performance in industrial applications. Made with original ICs from Toshiba, it offers capacities from 30GB to 960GB, and up to 3,000 P/E cycles. It has impressive sequential read/write speeds of 560 and 520MB/s, respectively. 
25th July 2019

SATA-6Gb/s-SSD designed for demanding industrial applications

SATA-6Gb/s-SSD designed for demanding industrial applications
  3D-NAND-based SSD’s are common in consumer markets. Swissbit has introduced a range of 3D-NAND-SSD products that are specifically optimised for demanding industrial- and NetCom applications. The X-75-range includes product versions with 2.5” housing, as well as m.2-, SlimSATA- and mSATA-modules.
23rd July 2019

How do you get a server rack in your back pocket?

How do you get a server rack in your back pocket?
imec has presented TEMPO: a cross-border collaboration between 19 research and industrial partners, funded by ECSEL Joint Undertaking which supports public-private partnerships in the EU. The three-year program aims at developing process technology and hardware platforms leveraging emerging memory technologies for neuromorphic computing for future applications in mobile devices that need complex machine-learning algorithms.
19th July 2019

Toshiba Memory to rebrand as 'Kioxia' in October 2019

Toshiba Memory to rebrand as 'Kioxia' in October 2019
Toshiba Memory Europe has announced that it will officially change its name to Kioxia Europe on 1st October, 2019. The name Kioxia (kee-ox-ee-uh) will be adopted for the names of all Toshiba Memory companies, largely effective on the same date. Kioxia is a combination of the Japanese word 'kioku' meaning 'memory' and the Greek word 'axia' meaning 'value'. Merging 'memory' with 'value', Kioxia represents the company’s mission to uplift the world with 'memory', which forms the foundation of the company’s vision.
18th July 2019

Flash memory devices to reduce production costs and time to market

Flash memory devices to reduce production costs and time to market
Microchip has announced the introduction of the SST26VF Serial Quad I/O (SQI) 3V Flash family, according to the company, it is the industry’s first NOR Flash devices tooffer integrated MAC address options. Pre-programmed with EUI-48 and EUI-64 addresses, the devices do not have a minimum order requirement, providing cost effective, plug-and-play storage solutions for connected applications that use Ethernet, Bluetooth, WiFi, IEEE 802.15.4 and FireWire.
15th July 2019

The importance of storage in the factory of the future

The importance of storage in the factory of the future
‘Factories of the future’ (FoF) is the European Union’s €1.15bn public private partnership for advanced manufacturing and production. It is the collaborative integration of Information Communicational Technology (ICT) and Automation Technology (AT) that has shifted the diverse manufacturing landscape. 
11th July 2019

Highly scalable module based on the latest embedded processors

Highly scalable module based on the latest embedded processors
Kontron has introduced the new SMARC-sXAL4 module. The module is available with either Intel Atom, Intel Pentium or Intel Celeron processors of the latest generation. With dimensions of only 82x50mm, it can be used flexibly, and the E2 version is designed for use in an extended temperature range from -40 to +85°C.
9th July 2019


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