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Ultracompact 2G/3G Dual-Mode RF Transceiver IC for Mobile Phones and 3G Communication Cards for PCs

22nd February 2008
ES Admin
Renesas Technology has announced the R2A60281LG, an ultra-compact 2G/3G dual-mode radio frequency (RF) transceiver IC that supports both 2G and 3G modes used in cellular communications. The device integrates in a single chip most of the high-frequency signal processing functions required by mobile phone handsets. Sample shipments will begin in March 2008 in Japan.
The RF transceiver IC performs functions such as converting received high-frequency wireless signals to a lower frequency for use by the baseband processor. It forms an essential part of the transceiver block of the mobile phone. The features of the R2A60281LG, summarized below, will facilitate the development of smaller and thinner handsets with support for global mobile telephony standards.

The R2A60281LG integrates 2G (GPRS/EDGE) quad-band (850 MHz/900 MHz/1.8 GHz/1.9 GHz) and 3G (W-CDMA) quad-band (800 MHz/1.5 GHz/1.7 GHz/2 GHz) functionality into a single chip. It also supports HSDPA*1 categories 7 and 8 (maximum. 7.2 Mbps), allowing high-speed data downloads along with support for global standards.

Approximately 20% smaller mounting area than previous RF transceiver ICs from Renesas Technology
In addition to the features mentioned above, the R2A60281LG integrates a low-noise amplifier (LNA) and other functions. It combines all high-frequency signal processing functions other than antenna switching in a single chip in a thin and compact package (7 × 7 × 0.60 mm) that has a mounting area approximately 20% smaller than previous RF transceiver ICs from Renesas Technology.

The R2A60281LG implements A/D and D/A conversion functions formerly handled by an analog baseband processor. It includes a high-speed (maximum 312 Mbps) digital interface function that enables high-speed exchange of I/Q and control data with a digital baseband processor, making possible high-speed transfer of large data volumes. Since no analog baseband processor is necessary, the combined mounting area is reduced.

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