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NEC Electronics Launches “Medity 2” for 3G Mobile Phone Handsets

25th January 2008
ES Admin
NEC Electronics announced the completion of the semiconductor platform solution Medity 2. Medity eases the development of mobile phones corresponding to the third and second generation communication standards HSDPA/W-CDMA and GSM/GPRS. Medity 2 consists of 5 components: (1) M2 which is an integrated chip with baseband processing functions and application processor, a semiconductor chipset that includes wireless frequency processing (RF) ICs and power ICs (2) software components such as communication software which can automatically switch between W-CDMA, GSM and middleware to control the application (3) software development evaluation board and kit (4) software development tools and (5) system integration services into the products. For the development of mobile phone handset equipment with longer standby times, the required features and functions from semiconductors to software as well as the integration of products can be obtained. This allows users to concentrate on their developmen
Medity2 incorporates W-CDMA and HSDPA technology developed by Adcore-Tech, a joint venture established by NEC, NEC Electronics and other handset and communications chip vendors.
In extension to NEC Electronics’ strategy for system LSI products with integrated digital baseband (“DBB“) processing functions and application processor, the company has been seeking to provide semiconductor solutions which include chipsets such as semiconductors for communication (e.g. RF) or power semiconductors, software, development tools and also the integration of those products.
In September 2006 as a first step for these semiconductor solutions, NEC Electronics announced, concurrently with the launch of the semiconductor solution Medity 1, the Medity™ concept which is centred on the system LSI M1 realizing low power consumption and enabling advanced media processing. Medity 1 allows customers to reduce the development effort for components and concentrate their resources on features that differentiate their mobile phone products, to cut their bill-of-material costs by reducing the total number of components and to reduce size and weight of handsets. As a new solution for mobile phone handsets it attracted a lot of attention in the market.

In July 2007 NEC Electronics introduced the M2, an integrated chip that realizes about twice the application performance as M1 and reduces power consumption by 50% compared to conventional technologies due to a low power consumption technology. M2 has been used as integrated chip with DBB and application processor in NEC Corporation’s mobile phone models N905i and N905iµ released in November 2007 as well as in the N905i Biz introduced in December 2007. These handsets of the N905i series achieve longest level standby and continuous talk times while corresponding to high speed communication in the international roaming services WORLD WING® (3G and GSM) and FOMA High Speed® (HSDPA). In order to further enhance applicability for M2 the company constantly improved its semiconductor platform solutions. At this time NEC Electronics completed the software and development tools for M2 and introduced them to the market.

NEC Electronics regards Medity 2 as a semiconductor platform solution that meets the demand for a reduction of development times for 3G mobile phones while providing excellent low power consumption ability combined with high application performance.

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