Boundary scan I/O modules enhance test coverage

21st October 2014
Mick Elliott

GOEPEL electronics has launched the CION-LX Module/FXT96, a new Boundary Scan module with high functionality and dynamics for test of analogue, digital and mixed signals at the ITC International Test Conference 2014 in Seattle. The module allows the extension of Boundary Scan test to non scannable circuit components such as connectors, clusters or analogue interfaces.

The standards IEEE1149.1, IEEE1149.6 and IEEE1149.8.1 are supported. There are 96 single-ended, 12 High Current and 24 differential channels available. Each channel is bi-directional and can be programmed using many different parameters. Unique in the industry, dynamic test resources such as frequency counter, event detector, arbitrary waveform generator or digitiser are available to increase test flexibility.

The new model is based on the ASIC CION-LX, a JTAG controllable Mixed Signal Tester-on-Chip (ToC), developed by GOEPEL electronics.

The CION-LX module can be connected to any Test Access Port (TAP) and can be cascaded to increase the number of channels. It can be operated in combination with other CION modules or ChipVORX modules.

In context of the Boundary Scan software platform SYSTEM CASCON a comprehensive automation of the entire project development is possible with minimal effort. Detected errors can be immediately displayed graphically in the layout as part of the Scan Vision tools.

The CION-LX Module/FXT96 can be used both for prototype test in the laboratory as well as in production. A live demo of the module can be seen at the electronica show in Munich

Featured products

Upcoming Events

View all events
Latest global electronics news
© Copyright 2024 Electronic Specifier