Automotive

Microchip Technology Inc today announced a new nine-member low-power, general-purpose operational amplifier (op amp) family—the MCP647X/8X/9X. These op amps provide among the industry’s best power consumption for a given gain-bandwidth product, including low quiescent current, to extend battery lifetimes. Additionally, they have exceptionally low leakage current over temperature, up to 125°C, which reduces errors in applications such as se...

Vishay Intertechnology, Inc today extended its VJ automotive series of surface-mount multilayer ceramic chip capacitors (MLCCs) for high-temperature automotive applications. To save board space, the VJ….31 / VJ….34 now offer a 0402 case size with an X8R dielectric. In addition, the 0603 and 0805 case sizes featuring an X8R dielectric have been enhanced, now offering working voltages of 100 V.

Vishay Intertechnology, Inc today introduced two new IHTH high-current, high-temperature through-hole inductors in the 0750 and 1125 case sizes. For automotive applications, the AEC-Q200-qualified IHTH-0750IZ-5A and IHTH-1125KZ-5A feature high operating temperatures to +155 °C, high rated currents to 125 A, and a wide range of inductance values from 0.47 µH to 100 µH.

TDK Corporation presents a new series of rugged EPCOS axial-lead aluminum electrolytic capacitors for automotive electronics. These components are distinguished by their very high ripple current capability and vibration resistance. Thanks to the very low ESR values and a further reduction in internal thermal resistance, the self-heating of the new B41689* series is significantly lower. This allows the ripple current capability to be increased by ...

Building on its industry-leading position in in-vehicle networking (IVN), NXP Semiconductors N.V. today introduced Mantis, a new family of HS-CAN transceivers. Mantis (TJA1044T and TJA1057T) and Mantis GT (TJA1044GT and TJA1057GT) offer a feature set targeting 12 V automotive applications and deliver excellent EMC performance, with the high-end “GT” variant guaranteeing critical parameters for CAN FD (Flexible Data rate) networks. All members...

Microchip Technology Inc today announced two new volatile, SPI digital potentiometers (digipots)—the MCP41HV31 and MCP41HV51 (MCP41HVXX)—its first to operate at 10, 12, 18, 24 and particularly 36 volts, for systems requiring wide signal swing or high power-supply voltages. Additionally, these digipots support both 7-bit and 8-bit resistor configurations, and a high terminal/wiper current, including the ability to sink/source up to 25 mA on a...

Axiomtek announces the debut of the new high-performance fanless embedded computing box suited for railway-centric PC, the tBOX321-870-FL. Built-in 3rd Generation Intel Core processor has been integrated into this robust system, Intel® Core™ i7-3517UE (up to 2.8 GHz) or Intel Core i3-3217UE (1.6 GHz) processor. The tBOX321-870-FL adopts an onboard processor and onboard DRAM which greatly reduces the impact of vibration and shock ideally...

Infineon Technologies today introduced its next generation of high-voltage IGBT gate drivers. Designed for the main inverter of hybrid and electric vehicles (HEV), the new EiceDRIVER SIL and the EiceDRIVER Boost drivers enable automotive system suppliers to more easily and more cost-effectively design HEV drivetrain subsystems that are compliant with ASIL C/D functional safety requirements (ISO 26262). Target applications of the new EiceDRIVERs a...

During development and production PROVERTHA puts a lot of effort to create products, which match perfectly with the addressed application needs. All related products were tested by a certified test house. The M12 D-Code connectors for field assembly address railway applications with rough environments. In addition to related vibration and shock tests the connectors have also passed harmful gas tests with very good results.

Fujitsu Semiconductor Europe today announced the development of MB86R24, the company's third-generation high-performance graphic SoCs for automotive applications. The new product will be made available in sample quantities starting in August 2013, along with the related software.