NXP to develop cutting-edge automotive-qualified 3.5G telematics solution to improve traffic management in Singapore
NXP Semiconductors N.V. today announced that it is developing a cutting-edge automotive-qualified 3.5G telematics solution to improve traffic management, which can help address the challenge of traffic congestion in Singapore. Expected to be deployed in 2012, NXP will develop innovative technologies based on NXP’s next-generation Automotive Telematics On-board Platform (ATOP). Singapore will be a test bed for ATOP, leveraging the city’s world...
OmniVision and Xilinx Develop Automotive Reference Design for 360-degree Surround View Applications
OmniVision Technologies, Inc. today announced that its OV9715 automotive-grade megapixel sensor has been selected by Xilinx, Inc. for its four camera, 360-degree surround view automotive reference design. The Xilinx reference design highlights the advantages of megapixel resolution sensors over VGA-based systems for extreme wide-angle field of view applications, such as greatly improved image distortion correction and stitching. Designed to meet ...
MEMS Accelerometer from STMicroelectronics Monitors and Tracks Motion and Tilt around the Car
STMicroelectronics has expanded its sensor portfolio with a new automotive-grade 3-axis low-g accelerometer. Combining low power consumption and small footprint with high precision and robust performance, ST’s new accelerometer targets a wide range of automotive applications, including vehicle tracking, event recording, abuse monitoring, and dead-reckoning for enhanced navigation capabilities.
STMicroelectronics Announces Accelerometers for Automotive Airbags
STMicroelectronics (NYSE: STM), a leader in automotive ICs and in MEMS (Micro-Electro-Mechanical Systems) sensors, has introduced a new family of high-g acceleration sensors for advanced airbag systems. These micro-machined devices detect the rapid deceleration of the vehicle during a crash and send instant information to the airbag control unit.
Toshiba unveils 130nm BiCD for next-generation automotive-rugged integration
Toshiba Electronics Europe has revealed details of its new BiCD process, which combines 130nm logic design rule with current-handling capability to permit unprecedented integration in devices such as sensorless BLDC motor drives. The process is able to guarantee full specification over a wide temperature range, as well as high ESD robustness, providing a platform for a variety of industrial and automotive IC projects.
SYSGO & OpenSynergy join forces for the automotive market
SYSGO AG and OpenSynergy GmbH, two German software companies, have signed an exclusive cooperation agreement targeting the automotive market. They will join forces to provide carmakers with a software platform that already meets both avionics safety standards and AUTOSAR (Automotive Open System Architecture) requirements. Rolf Morich, general manager at OpenSynergy, said in a joint press release, “The high quality standards of SYSGO’s technol...
MEMS rate sensor from Murata features stable thermal performance and high reliability for accurate dead-reckoning
Murata has launched a MEMS rate sensor (gyro) which features excellent performance characteristics for the automotive market. The device, part number MEV-50C-R, supports accurate dead-reckoning performance for car navigation devices, but is also aimed at GPS modules, satellite antennas and other applications such as toys, including for example a high performance radio control helicopter. This sensor features the second-generation of Murata's tech...
Altium seeks to accelerate activity in European automotive sector
Altium has announced a new key role within its EMEA team to accelerate its activity in the European automotive sector. Michael Schua has been appointed Business Development Manager Automotive.
Pan-European eCall Trial of NXP and Partners Concludes in Brussels
This week sees the successful conclusion of a field trial designed to prove that the European emergency call system ‘eCall’ for vehicles is ready for mass deployment across Europe. The trial, which was initiated by NXP Semiconductors N.V., involved major industry players including BMW, IBM, Allianz OrtungsServices, Deutsche Telekom, Dekra, and European automobile clubs such as Touring, ANBW, AvD, and UAMK. Three cars equipped with NXP’s tel...
Infineon - Microcontrollers for Automotive M2M Systems; SLI 76 Family Is Industry’s First to Address the Stringent Automotive Quality Standards
Infineon Technologies announced its new SLI 76 “in Car” family of microcontrollers for the use in automotive Machine-to-Machine (M2M) systems. They are the industry’s first UICC (Universal Integrated Circuit Card) microcontrollers that are qualified by the stringent processes of the Automotive Electronics Council (AEC) Q100 quality standard. The SLI 76 “in Car” chips offer long lifetime, high data retention, extended temperature range, ...