At SEMICON West 2015, which takes place from 14th to 16th July at the Moscone Center in San Francisco, Nordson DAGE will exhibit in booth 5744. Here, the company will present the 4800 wafer level Bondtester for the first time in North America.
The Nordson DAGE 4800 Bondtester is at the forefront of wafer testing technology, developed for testing wafers from 200 up to 450mm. Featuring the Nordson DAGE Paragon software, the device provides users with the flexibility to create and map wafers, enabling quick and precise setup of test patterns. The virtual images for each test pattern enable easy editing.
At the event, Nordson DAGE will also showcase its 4000Plus Bondtester Camera Assist Automation System, ideally suited for pull-and-shear testing of wafer interconnections, lead frames, hybrid microcircuits or automotive electronic packages. Additionally, the company’s X-Plane and CT options will be demonstrated at the show. X-Plane uses a proprietary, patent applied for, tomosynthesis, or CT technique to create 2D X-ray slices in any plane of a PCBA without the need to cut or destroy the board.
Nordson DAGE’s XM8000 wafer metrology platform provides an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. It provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay and critical dimensions.