Test and inspection solutions for electronics development and production will be showcased by Goepel at electronica 2018 in Munich (November 13-16). Centre stage is ChipVORX-SI, a future-oriented platform using powerful FPGA-IP for test & in-system programming.
The cloud-based corepiler solution combines maximum flexibility with easy handling and no need for special knowledge. ChipVORX-SI will support completely new application possibilities in the future.
The JULIET Series 3 undertakes electrical testing in the production environment. The compact test system combines the entire system electronics and the UUT (Unit Under Test) adaptation in one device. This third series incorporates a discharge circuit and a CION-LX module to use design-embedded processors as intelligent control units for universal test and programming operations.
In the field of inspection solutions the AOI system THT Line has been significantly expanded with a camera module now enables the 3D inspection of THT solder joints. This allows the inspection of solder flow and solder volume as well as the height determination of THT pins. PCBs can be handled both with and without workpiece carriers.
The stand-alone AOI system Basic Line · 3D is now also equipped with a new camera module. The 3D · ViewZ combines 3D metrology and full angled-view inspection. This allows viewing assemblies in 360° steps for maximum fault detection. Low-volume manufacturers now can use 3D AOI at low cost.