On Stand 279 in Hall 5 at the Embedded World exhibition in Nuremberg, SWINDON Silicon Systems will be highlighting the advantages of System on Chip (SoC) and System in Package (SiP) solutions as part of ASIC development and production. Already renowned for its design expertise and experience in the supply of mixed signal ASICs, the company has seen a dramatic increase in the number of companies approaching them for more complex ASIC systems.
For electronics engineers not familiar with SoC and SiP systems, a SoC in the mixed signal ASIC domain is an IC that combines all the required analog and digital functions along with an embedded microprocessor, such as an ARM core or an 8051, depending upon the processing power required. This means the SoC is a complete electronic subsystem that may contain analogue, digital, mixed-signal and radio frequency functions with the added advantage of a powerful processor as its core.
The ASIC / SoC is the next level of integration where all required system functions are designed into one IC, where appropriate. A SiP is typically an ASIC / SoC in bare die form, integrated with another IC, usually a microelectromechanical sensor(MEMS) - all in a single package, providing an efficient but powerful full system solution.
Members of the SWINDON team will be on hand to discuss the advantages of SoC and SiP systems for industrial and automotive applications and show how they are customised in-house to customers’ exact requirements, resulting in higher performance, smaller size and lower costs.
Visitors to the stand will also be able to discuss how SWINDON Silicon can provide a full turnkey service that ensures the correct solution for industrial and automotive applications. The SWINDON solution combines technical innovation and excellence with high performance and low cost custom devices, delivering a solution that will gives the competitive edge, both technically and commercially.