FCI present three connector solutions at DesignCon

17th January 2014
Posted By : Nat Bowers
FCI present three connector solutions at DesignCon

At DesignCon 2014 (January 28-31, Santa Clara, USA), FCI will present three interconnect solutions in Booth 403. The connector solutions are an I/O cabling solution, a connector for high current density and low power loss applications, and a connector for applications requiring a direct pluggable connection to an uninsulated bus bar.

The first product to be unveiled at DesignCon 2014 is an I/O cabling solution supporting signal transmission speeds of up to 40Gb/s. Suitable for high speed 25G+ packaging applications where signal performance integrity is critical, the connector minimises impedance mis-match and signal loss. The second device FCI will reveal has been developed specifically to address applications that require higher current density and less power loss in a low-profile form factor. Offering a 30% reduction in contact resistance, this connector increases its current carrying capacity and features molded-in guide pins to facilitate modular system assembly. The third product that will be exhibited at the show complements FCI’s bus bar power distribution products by providing improved electrical performance and long-term reliability. It is designed for applications in which a direct pluggable connection to an uninsulated bus bar is required.

Aside from these three solutions, FCI will also be showcasing its latest products within each of the following categories: High Speed Backplane, High Speed I/O, Commercial, Storage, Consumer and Power Solutions. FCI has partnered with two external vendors for these demos so that design engineers and manufacturers can have a better understanding of the applications for these devices. Visitors who visit the FCI booth can also take part in a draw for the chance to win either iPad minis or an iPad Air.

“We are excited to be able to share our new solutions to the diverse audience present at DesignCon 2014. This gives us an opportunity to explore how our solutions can address increasingly stringent requirements across different industries. Although the three new solutions belong to different product categories, they are all designed with high performance, improved reliability and innovative architecture in mind. We believed that these versatile products will lay the foundation for the next-generation of electronics and instruments across a wide range of industries,” comments Danny Morlion, Chief Technology Officer, FCI Electronics.


You must be logged in to comment

Write a comment

No comments




Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

Imagineering Fair at Bath & West Show
30th May 2018
United Kingdom The Royal Bath & West Society Showground, Somerset
PCIM 2018
5th June 2018
Germany Nuremberg
Developing secure and scalable IoT solutions
21st June 2018
United Kingdom Cocoon Networks, London
SENSOR+TEST 2018
26th June 2018
Germany Nürnberg Exhibition Centre
European Microwave Week 2018
23rd September 2018
Spain Ifema Feria De Madrid