SWINDON Silicon Systems, a Sensata Technologies company, will showcase and highlight how its knowledge of mixed signal ASIC/MEMS and System on Chip (SoC) and System in Package (SiP) technology will benefit industry’s move towards intelligent sensing.
On Booth 149 in Hall 3 at embedded world 2017, specialists from the SWINDON engineering team will be available to discuss how their custom-designed ASIC, SoC and SiP solutions apply intelligence and transform raw data into valuable information.
As engineers work towards automating many applications, the need for intelligent sensing systems is increasing. There are many parameters that system designers need to consider and the options available are varied. One option that is becoming more and more popular is the mixed signal ASIC. By taking time to work through all the system requirements with an experienced and proven ASIC solutions provider prior to making a decision, time and effort can be saved and a solution quickly agreed.
embedded world provides managers and engineers with the suitable opportunity to talk through their specific development projects and requirements with experts in this field.
Visitors to the booth will discover how SWINDON’s integrated ASIC, SoC and SiP and MEMS custom sensor solutions are at the heart of intelligent sensing.