Compact electronic housings exhibited at SPS IPC Drives 2014

15th December 2014
Source: HEITEC AG
Posted By : Siobhan O'Gorman
Compact electronic housings exhibited at SPS IPC Drives 2014

At the SPS IPC Drives 2014, which took place from 24th to 26th November in Nuremburg, HEITEC demonstrated its latest software, electronic and mechanical components. From its wide range of electronic housings, the company presented two CompactPCI Serial products, which are available with Ethernet Star or Full Mesh backplane technology in scalable designs.

The products, which are based on the 19" standard, are highly modular and stable, making them suitable for use as housing and system platforms for applications in industrial environments.

The first product is a 40HP wide installation housing (4U high for 3U modules), which can be equipped with various types of power supplies, from 300W ATX PSU solutions through to two parallel plug-in power supplies for PSU redundancy. The housing is designed for maximum air flow to provide optimised cooling and can also be used without a fan. The 40TE system utilises a 5-slot CompactPCI Serial native backplane with Ethernet star topology. The system slot is located on the right side, so double-wide (8HP) CPU units can be used without abandoning the peripheral slots. The housing design also supports backplanes with the system slot on the left. In addition, it will soon be possible to have DC power supplies, which are used for example in traffic engineering or telecommunications.

The company will also present a desktop housing solution which is 4U in height, 84HP in width, has a replaceable fan tray (1U) with up to three fans and may also be used as a 19" rack system. The housing utilises a 9-slot Full Mesh CompactPCI Serial backplane with the system slot on the right side. The desktop housing is based on the proven HEITEC Vario Module series, for which a wide range of additional components is available.

Potential industrial areas of application for the CompactPCI Serial platforms are traffic engineering, industrial automation and machine control, telecomms, research, medical technology and energy generation and control. Due to the high data transmission rate on the Full Mesh backplanes, the platforms are also suitable for multiprocessing applications, which could not be fully addressed by the classic CompactPCI because of its bus structure.

In addition to native CompactPCI Serial system housings, HEITEC supports hybrid systems for specific customer projects. The housings will be available in Q1 2015.


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